Photocurable and thermally curable resin composition and dry film type solder resist

A thermosetting resin and photocuring technology, applied in optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc., can solve the problem of not being able to properly meet PCT tolerance, TCT heat resistance, HAST tolerance , Solder resist does not have problems such as high glass transition temperature heat resistance and reliability, and achieves excellent heat resistance reliability, low thermal expansion coefficient, and high developability

Active Publication Date: 2019-10-29
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a solder resist formed of a resin composition does not have a high glass transition temperature and correspondingly sufficient heat resistance reliability, and thus cannot suitably satisfy PCT resistance, TCT heat resistance, HAST between thin metal wires, etc. Resistance, etc., these characteristics are necessary for packaging substrate materials for semiconductor devices

Method used

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  • Photocurable and thermally curable resin composition and dry film type solder resist
  • Photocurable and thermally curable resin composition and dry film type solder resist
  • Photocurable and thermally curable resin composition and dry film type solder resist

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0179] The cyanate group of Lonza's bisphenol cyanate compound (BA-230) and 1,2,3,6-tetrahydrophthalic acid (4-cyclohexene-1,2-dicarboxylic acid ) reacted at a molar ratio of 1:1 to prepare the iminocarbonate-based compound 1 as an acid-modified oligomer.

[0180] The acid value of the prepared iminocarbonate compound 1 was 145 mgKOH / g. At this time, the acid value of the prepared iminocarbonate-based compound 1 was measured by dissolving about 0.1 g of a sample in a 1:1 mixture of xylene and isopropanol, specifically by a method according to ASTM D1639 .

[0181] Using 10% by weight of the iminocarbonate-based compound 1, it was mixed with 15% by weight of ZAR-2000 and 8% by weight of CCR-1171H (Nippon Kayaku, Co., Ltd.), 5% by weight of DPHA (SK CYTEC CO., LTD.) as a photopolymerizable monomer, 2.5% by weight of TPO as a photoinitiator, 10% by weight of YDCN as a thermosetting adhesive- 500-8P (Nippon Kayaku, Co., Ltd.), 0.95% by weight of 2-PI as a thermosetting binder c...

Embodiment 2

[0185] A dry film and a printed circuit board were prepared in the same manner as in Example 1, except that 15% by weight of the iminocarbonate-based compound 1 was used and the content of the iminocarbonate-based compound Increasing the amount of solvent used increases.

Embodiment 3

[0187] A dry film and a printed circuit board were prepared in the same manner as in Example 1, except that: as shown in Table 1 below, 25% by weight of the CCR-117H was used, and as the photopolymerizable monomer 5% by weight of TMPA (SKCYTEC CO., LTD.) was used, and 8% by weight of YDCN-500-8P (Nippon Kayaku, Co., Ltd.) was used as the thermosetting adhesive.

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Abstract

The present invention relates to a resin composition having photocurable properties and heat-curable properties, and to a dry film solder resist manufactured therefrom. More particularly, the resin composition having photocurable properties and heat-curable properties comprises: an acid modified oligomer including an iminocarbonate-based compound having a carboxylic group, and an acid value of 100-180 mg KOH / g; a photocurable monomer having at least two photocurable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a photoinitiator; and an inorganic filler including 50-90 wt% of silica.

Description

technical field [0001] The invention relates to a photocuring and thermosetting resin composition and a dry film solder resist. More specifically, the present invention relates to a dry film for providing performances such as having high developability, making it easier to realize fine pitches, low alpha particle emission rate, low dielectric constant, low thermal expansion coefficient, and excellent heat resistance reliability. A photocurable and thermally curable resin composition of a film type solder resist and a dry film type solder resist having said properties. Background technique [0002] With the miniaturization and weight reduction of various electronic devices, photosensitive solder resists capable of forming minute opening patterns have been used in printed circuit boards, semiconductor packaging substrates, flexible circuit boards, and the like. [0003] Semiconductor packaging products are composite materials composed of insulators such as epoxy resin molding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/027G03F7/038
CPCG03F7/004G03F7/027G03F7/038C08G64/14C08K3/36C08L69/00G03F7/032G03F7/0752
Inventor 庆有真崔炳柱郑遇载崔宝允李光珠郑珉寿
Owner LG CHEM LTD
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