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Solder in Cavity Interconnection Technology

A cavity, solder bump technology used in soldering equipment, thin material handling, electrical connection of printed components, etc., to solve problems such as stress or fatigue related failures

Inactive Publication Date: 2016-10-12
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Additionally, existing devices can be prone to a number of failures, including stress or fatigue-related failures between the solder balls and other components, such as delamination of the low-k dielectric below the solder joint

Method used

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  • Solder in Cavity Interconnection Technology
  • Solder in Cavity Interconnection Technology
  • Solder in Cavity Interconnection Technology

Examples

Experimental program
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Embodiment Construction

[0027] According to some embodiments, interconnection techniques may use cavity spacers between solder bumps to maintain separation between soldered interconnections. In some cases, these walls can reduce bridging or fracture failures of solder connections. In addition, in some cases, the reliability of the connection can be improved.

[0028] In some embodiments, instead of depositing solder balls, solder may be molded in place in a cavity on a component to be bonded to another component. Solder balls can then be formed in place within the cavity. Thus, in some embodiments, cavity partitions may provide separation between adjacent pads, reduce bridging, and in some embodiments allow for smaller interconnect pitches. In addition, the intervening walls may serve to strengthen or support the weld, especially in response to lateral loads.

[0029] According to one embodiment, as figure 1 As shown, a plurality of metal pads or bumps 12 may be formed on the substrate 10 . Subs...

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Abstract

The present invention discloses a solder in cavity interconnection Technology which uses molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

Description

technical field [0001] Generally, the present invention relates to the art of interconnecting integrated circuits. Background technique [0002] Integrated circuit interconnection technology mechanically and electrically connects two electronic components. For example, solder balls can be used to connect an integrated circuit to a printed circuit board, such as a motherboard. The integrated circuit is placed on the motherboard with solder balls in between. In a process called reflow, when heated, the solder is softened and a solder joint is formed between the devices. [0003] While this type of surface mount or C4 connection has been extremely successful, there is a continuing desire to increase the density of interconnections that can be formed. The more interconnections per unit area that can be formed, the smaller the resulting device can be. In general, the smaller the device, the lower its cost and the higher its performance. [0004] Furthermore, existing devices...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/60B23K1/00B23K1/20B23K3/06
CPCB23K1/0018B23K1/203B23K3/0623H01L24/11H01L24/81H01L24/13H01L2224/11442H01L2224/10135H01L2224/1148H01L2224/11474H01L2224/11849H01L2224/13021H01L2224/13022H01L2224/131H01L2224/16238H01L2224/1403H01L2224/81139H01L2224/81193H01L2224/81191H01L2224/81201H01L2924/14H01L2924/014H01L2924/01029H01L2924/01033H01L2924/01047H01L2924/01078H01L2924/01006H01L2924/01004H01L2924/01005H01L2924/00014H01L2924/00H01L2224/10145H01L2924/3841H01L2224/05647Y10T428/12222B23K2101/40H05K1/11H05K13/0465H05K1/0271H05K2201/10734
Inventor C.胡
Owner INTEL CORP