Rapid board-grinding and film-pasting method for outer layer circuit board
A technology for circuit boards and filming, which is used in the removal of conductive materials by chemical/electrolytic methods, printed circuits, and printed circuit manufacturing. Increase, improve production efficiency, increase the effect of board surface roughness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0033] A method for quickly grinding and pasting films on outer circuit boards, comprising the following steps:
[0034] into the board;
[0035] Pickling: The pickling tank solution is prepared by using 3%-5% sulfuric acid. The circuit board to be processed passes through the pickling section horizontally, and the solution is sprayed to the surface of the board through the upper and lower nozzles. The pressure of the pickling spray is 1.8±0.2kg / cm2 , the temperature is normal temperature, the purpose is to remove the oxide on the board surface;
[0036] The first water washing: tap water passes through the nozzle to clean the board surface, and the washing pressure is 1.3±0.3kg / cm2 to remove the acid liquid on the board surface to prevent acid corrosion and brushing;
[0037] Needle brush grinding plate: The grinding brush used in the needle brush grinding plate section is 500# needle brush, the density of the needle brush is 150 brush needles per square meter, 2 groups of 4...
Embodiment 20
[0045] The steps and parameters of Example 20 are the same as those of Example 1, only the second water washing is added in the step of removing volcanic ash, the water washing pressure is 1.3±0.3kg / cm2, and the swinging high-pressure water washing is performed after the second water washing.
Embodiment 21
[0046] The steps and parameters of Example 21 are the same as those of Example 1, except that ultrasonic cleaning is added in the step of removing volcanic ash, and after ultrasonic cleaning, high-pressure water washing with swinging is performed.
PUM
Property | Measurement | Unit |
---|---|---|
Hardness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com