Rapid board-grinding and film-pasting method for outer layer circuit board

A technology for circuit boards and filming, which is used in the removal of conductive materials by chemical/electrolytic methods, printed circuits, and printed circuit manufacturing. Increase, improve production efficiency, increase the effect of board surface roughness

Active Publication Date: 2016-10-12
江西景旺精密电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the pretreatment production speed of the outer layer line is generally between 2.5-2.8m/min in the industry; the film lamination speed is between 2.8-3.0m/min, and the single-line production capacity is low; The orig

Method used

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  • Rapid board-grinding and film-pasting method for outer layer circuit board
  • Rapid board-grinding and film-pasting method for outer layer circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for quickly grinding and pasting films on outer circuit boards, comprising the following steps:

[0034] into the board;

[0035] Pickling: The pickling tank solution is prepared by using 3%-5% sulfuric acid. The circuit board to be processed passes through the pickling section horizontally, and the solution is sprayed to the surface of the board through the upper and lower nozzles. The pressure of the pickling spray is 1.8±0.2kg / cm2 , the temperature is normal temperature, the purpose is to remove the oxide on the board surface;

[0036] The first water washing: tap water passes through the nozzle to clean the board surface, and the washing pressure is 1.3±0.3kg / cm2 to remove the acid liquid on the board surface to prevent acid corrosion and brushing;

[0037] Needle brush grinding plate: The grinding brush used in the needle brush grinding plate section is 500# needle brush, the density of the needle brush is 150 brush needles per square meter, 2 groups of 4...

Embodiment 20

[0045] The steps and parameters of Example 20 are the same as those of Example 1, only the second water washing is added in the step of removing volcanic ash, the water washing pressure is 1.3±0.3kg / cm2, and the swinging high-pressure water washing is performed after the second water washing.

Embodiment 21

[0046] The steps and parameters of Example 21 are the same as those of Example 1, except that ultrasonic cleaning is added in the step of removing volcanic ash, and after ultrasonic cleaning, high-pressure water washing with swinging is performed.

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Abstract

The invention discloses a rapid board-grinding and film-pasting method for an outer layer circuit board. The rapid board-grinding and film-pasting method comprises the following steps of putting a circuit board; performing acid washing; performing water washing for the first time; grinding the board by a needle brush; grinding the board by volcanic ash; removing the volcanic ash; drying by hot air; preheating the board surface; pasting a film; and collecting the board, wherein the grinding brush used in the step of grinding the board by the needle brush is 450#-550# needle brush; the volcanic ash used in the step of grinding the board by the volcanic ash is 18-25% in concentration; the first group of hot pressing rolling wheels of the film-pasting machine used in the film-pasting step are 68 plus or minus 2 degrees in hardness; the second group of hot pressing rolling wheels of the film-pasting machine used in the film-pasting step are 72 plus or minus 2 degrees in hardness; the two groups of the hot pressing rolling wheels of the film-pasting machine used in the film-pasting step are 5.5-6.5kg/cm<2> in pressure; and the two groups of the hot pressing rolling wheels of the film-pasting machine used in the film-pasting step are 115-135 DEG C in temperatures. By adoption of the rapid board-grinding and film-pasting method, the film-pasting speed can reach 3.8-4.0m/min; and meanwhile, the quality of the product can be ensured.

Description

technical field [0001] The invention belongs to the technical field of PCB board processing, and relates to a method for quickly grinding and pasting films on outer circuit boards. Background technique [0002] The circuit board production process includes: board feeding-acid washing-water washing-needle brush grinding board-volcanic ash grinding board-removing volcanic ash-hot air drying-board surface preheating-film-receiving board. At present, the pretreatment production speed of the outer layer line is generally between 2.5-2.8m / min in the industry; the film lamination speed is between 2.8-3.0m / min, and the single-line production capacity is low; The original production process has insufficient adhesion on the surface of the board, which will cause residual copper if it is slight, and will cause permeation and plating if it is serious, and will cause quality problems such as film throwing if it is more serious. Contents of the invention [0003] Aiming at the deficien...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0044H05K3/06H05K2203/025H05K2203/11
Inventor 王海洋段绍华罗松
Owner 江西景旺精密电路有限公司
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