Highly adhesive thermoplastic polyimide resin, polyimide film containing same, and flexible copper clad plate

A technology of polyimide resin and polyimide film, which is applied in the fields of polyimide film, flexible copper clad laminate, and high-adhesive thermoplastic polyimide resin, which can solve the problem of increased product cost and mechanical properties of TPI film. Reduce problems such as improving peel strength, increasing surface roughness, and strong bonding ability

Active Publication Date: 2018-02-16
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There have been many reports of grafting the surface of TPI film, grafting pyridine, vinylpyridine, imidazole, benzimidazole, etc. on the PI film, and then using vacuum sputtering to form a coordination bond with Cu. Increase the peel strength between TPI film and copper foil to 1.5N / mm, but increase the product cost and reduce the mechanical properties of TPI film

Method used

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  • Highly adhesive thermoplastic polyimide resin, polyimide film containing same, and flexible copper clad plate
  • Highly adhesive thermoplastic polyimide resin, polyimide film containing same, and flexible copper clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] 1. Synthesis of high adhesive TPI resin

[0030] Step 1: Add 1.0 parts of 2-3 μm flakes to 399 parts of N,N-dimethylacetamide, and stir mechanically for 2 hours to obtain an inorganic dispersion;

[0031] Step 2: Add 20.249 parts of 4,4-diaminodiphenyl ether and 20.249 parts of 3,4-diaminodiphenyl ether to the inorganic dispersion prepared in step 1, stir and dissolve for 30 minutes, and add 59.523 parts in 6 times Parts of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride, and each time at an interval of 30min, and finally stirred for 4h to obtain a high-adhesive TPI resin (resin solid content is 20w / w%, Inorganic particles / resin 1.0 w / w%).

[0032] 2.2 L-FCCL preparation

[0033]Step 1: Coat the high-adhesive TPI resin synthesized in the previous step 2 on the PI film with a thickness of 12.5 μm and high dimensional stability produced by Kaneka Company in Japan, and pass 80°C / 30min→140°C / 30min→190°C / 30min→240°C / 30min→290°C / 30min→320°C / 30min degree of thermal im...

Embodiment 2

[0037] 1. Synthesis of PI resin with high dimensional stability

[0038] At room temperature, dissolve 23.932 parts of 4,4-diaminodiphenyl ether in 450 parts of N,N-dimethylacetamide, stir and dissolve for 30 minutes, add 4,4-diaminodiphenyl ether in 5 times 26.086 parts of pyromellitic dianhydride in an equimolar amount of diphenyl ether were stirred and reacted for 6 hours to prepare a PI resin with high dimensional stability (solid content: 10w / w%).

[0039] 2. Synthesis of high adhesive TPI resin

[0040] The preparation method is the same as in Example 1.

[0041] 3. Preparation of flexible copper clad laminate

[0042] Step 1: Scrape-coat the above-mentioned synthetic high-dimensionally stable PI resin on a smooth glass plate, and pass 80°C / 30min→140°C / 30min→190°C / 30min→240°C / 30min→290°C / 30min→320°C / 30min Degree of thermal imidization to obtain a PI film with high dimensional stability; then coat the high-adhesive TPI resin synthesized above on the PI film with high d...

Embodiment 3

[0046] 1. Synthesis of PI resin with high dimensional stability

[0047] At room temperature, 26.892 parts of 4,4-diaminodiphenyl ether and 14.523 parts of p-phenylenediamine were dissolved in 400 parts of N,N-dimethylpyrrolidone, stirred and dissolved for 30 minutes, and added in 5 times with two 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride in an equimolar amount of amine, and stirred for 6 hours to prepare a PI resin with high dimensional stability (solid content: 20w / w%).

[0048] 2. Synthesis of high adhesive TPI resin

[0049] The preparation method is the same as in Example 1.

[0050] 3. Preparation of flexible copper clad laminate

[0051] Step 1: Scrape-coat the above-mentioned synthetic high-dimensionally stable PI resin on a smooth glass plate, and dry it at 80°C / 30min→140°C / 30min to obtain a self-supporting PI film; then apply the above-mentioned synthetic high-adhesive The permanent TPI resin is coated on the PI base film with high dimensional stability...

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Abstract

The invention discloses a highly adhesive thermoplastic polyimide resin, a polyimide film containing the same, and a flexible copper clad plate. The highly adhesive thermoplastic polyimide resin is prepared from the following raw materials in parts by weight: 0.1 to 7.5 parts of inorganic particle, 0.1 to 2.5 parts of hydroxyl apatite and nano silica, 21 to 79 parts of diamine, 21 to 63 parts of aromatic diamine and aliphatic diamine, 26 to 118 parts of dianhydride, and 325 to 450 parts of aprotic polar solvent. A TPI film prepared from the polyimide resin, a polyimide film, and a copper foilare laminated to form a flexible copper clad plate. Even if the thickness of the TPI layer is 2.0 [mu]m, the peeling strength between the TPI film and the copper foil is not less than 1.0 N/mm; the TPI and PI can be bent for more than 50 times; at the same time, the surface electrostatic adsorption, CTE, and water absorbing performance of obtained TPI film are reduced; and the mechanical properties, heatproof performance, flame retardant property, and insulation property of obtained TPI film are enhanced to a certain degree.

Description

technical field [0001] The invention relates to a polyimide material, in particular to a high-adhesive thermoplastic polyimide resin, a polyimide film containing the resin and a flexible copper-clad board. Background technique [0002] With the rapid development of electronic products towards high performance, high density and high integration, higher performance requirements are put forward for flexible copper clad laminates as substrates, that is, in order to ensure stable performance and signal integrity of circuits during processing and use. Accurate transmission requires that when the thickness of the thermoplastic polyimide (TPI) layer that acts as an adhesive in the copper-clad board is as low as 2.0 μm, and the thickness of the polyimide (PI) film with high dimensional stability is as low as 8.5 μm, the PI film and The peel strength of the copper foil is still greater than 0.8N / mm, and the TPI film and the PI film have good bending resistance. However, the thickness...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K7/00C08K7/18C08K3/32C08K3/36C08J5/18B32B15/08B32B15/20B32B33/00C08L79/08
CPCB32B15/08B32B15/20B32B33/00B32B2255/10B32B2255/26B32B2307/206B32B2307/306B32B2307/54B32B2307/554B32B2307/726B32B2307/734B32B2457/00C08G73/1071C08G73/1075C08G73/1082C08J5/18C08J2379/08C08K3/32C08K3/36C08K7/00C08K7/18C08K2003/325C08K2201/003C08K2201/011
Inventor 姬亚宁陈志平刘业强青双桂黄孙息
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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