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NiZn ferrite material thermal shock resistance evaluation method

A technology of ferrite materials and impact performance, applied in the direction of analysis materials, strength characteristics, measuring devices, etc., can solve the problems that the thermal shock resistance of NiZn ferrite materials cannot be effectively evaluated, and achieve simple, feasible, and evaluation of test equipment The effect of quick method

Inactive Publication Date: 2016-10-19
SHENZHEN ZHENHUA FU ELECTRONICS
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for evaluating the thermal shock resistance of NiZn ferrite materials, aiming to solve the problem that the thermal shock resistance of NiZn ferrite materials cannot be quickly and effectively evaluated in the prior art

Method used

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] Such as figure 1 Shown, the embodiment of the present invention provides a kind of NiZn ferrite material thermal shock performance evaluation method, it comprises the following steps:

[0023] Provide a NiZn ferrite material sample as a test sample, specifically, the NiZn ferrite material sample can be prepared by the traditional oxide ceramic method production process;

[0024] Put the NiZn ferrite material sample into the heater to raise its temperature to T1, and keep it warm for h minutes, that is, keep it warm for a period of time, so that the inside and outside of the NiZn ferrite mat...

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Abstract

The invention belongs to the technical field of material testing, and discloses a NiZn ferrite material thermal shock resistance evaluation method. According to the method, a NiZn ferrite material sample is heated to a certain temperature T1, thermal insulation is performed for a certain time, the material is quickly taken out and then is placed into a cooling medium T2, the residual strength is tested under different thermal shock temperature difference [delta]T through a three-point bending method, the [delta]T is equal to T1-T2, the relation curve between the residual strength [sigma] of the NiZn ferrite material sample and the thermal shock temperature difference [delta]T is obtained, and the thermal shock temperature difference corresponding to the sharply-reduced residual strength [sigma] is the critical thermal shock temperature difference [delta]Tc of the NiZn ferrite material, such that the NiZn ferrite material thermal shock resistance can be evaluated. The method of the present invention is quick and effective, and the test equipment is simple and feasible.

Description

technical field [0001] The invention belongs to the technical field of material testing, and in particular relates to a method for evaluating the thermal shock resistance performance of a NiZn ferrite material. Background technique [0002] Soft ferrite materials mainly include two series of MnZn and NiZn ferrites, which are widely used in communication, computer network, power supply and consumer electronics, and are important basic functional materials in the electronic information industry. As an important class of soft ferrite materials, NiZn ferrite is favored in the high-frequency (1-300MHz) field due to its advantages of high resistivity, good high-frequency characteristics, and low loss tangent. [0003] At present, during the actual service of NiZn ferrite, due to temperature changes in the working environment or self-heating, etc., thermal stress is generated inside the material. When the thermal stress exceeds the strength of the material itself, cracks will initi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/60
Inventor 周鹏欧阳晨鑫徐晓燕黄伟浩徐阳朱建华高永毅
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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