A method for preparing superabrasive tools through ultrasonic-assisted active connection

A technology of active connection and superhard abrasive grains, applied in manufacturing tools, turning equipment, grinding devices, etc., can solve the problems of restricting the promotion of brazing abrasive grain tools, short tool life, unstable processing process, etc. The effect of liquid surface tension, promoting flow, and shortening chemical corrosion

Active Publication Date: 2018-05-25
HUAQIAO UNIVERSITY
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  • Claims
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Problems solved by technology

Nevertheless, many statistical data still show that: in the use of brazed diamond tools, more than one-third of the abrasive grains basically fail prematurely without participating in the cutting task, resulting in unstable processing and short tool life. Protracted Technical and Process Difficulties
[0004] There is no doubt that the above problems seriously restrict the promotion of the application of brazed abrasive tools

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  • A method for preparing superabrasive tools through ultrasonic-assisted active connection
  • A method for preparing superabrasive tools through ultrasonic-assisted active connection
  • A method for preparing superabrasive tools through ultrasonic-assisted active connection

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Embodiment Construction

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0029] In order to solve the problems of thermal damage and excessive residual stress in the existing technology of brazed abrasive tools, the present invention provides a method for preparing superhard abrasive tools through ultrasonic-assisted active connection. Solving prior art problems with ultrasonic correlation effects.

[0030] The method for preparing superabrasive grain tool by described ultrasonic-assisted active connection, at first, such as figure 1 As shown, the diamond abrasive grain 1 and the NiCrBSi active bond 2 are coated on the tool substrate (No. 45 steel) 3, and the thickness of the active bond 2 is 0.3 times the diameter of the abrasive grain. After drying, the coated abrasive The grain 1 and the abrasive grain matrix 3 of the bond 2 are fixed on the ultrasonic horn 4 through screw connection.

[0031] Then, if figur...

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Abstract

The invention provides a method for preparing a superhard abrasive particle tool through ultrasonic-assisted active connection. The method comprises the following steps that A, a tool base body coated with active bonding agents and abrasive particles is fixed to an ultrasonic amplitude-change pole; B, the tool base body is subjected to braze heating and temperature rising technology operation, after the active bonding agents reach the melting temperature, first ultrasonic waves are applied to the tool base body, and chemical bonding and the wetting climbing effect of the active bonding agents and interfaces of the abrasive particles are facilitated through the ultrasonic effect; C, after the temperature rising technology is completed, the first ultrasonic waves are stopped applying, when the temperature of a connection zone is lowered to the liquid-solid converting temperature of the active bonding agents, second ultrasonic waves start to be applied to the tool base body, and heat stress releasing in the cooling process is conducted through high-frequency vibration of the second ultrasonic waves; and D, after the temperature of the connection zone is lowered to the tempering temperature of the active bonding agents, processing is stopped, and after temperature of the connection zone is further cooled to the room temperature, the abrasive particle tool is obtained.

Description

technical field [0001] The invention relates to the preparation technology of abrasive grain tools, in particular to a method for preparing abrasive grain tools through ultrasonic-assisted active connection. Background technique [0002] Diamond tools play an irreplaceable role in the high-efficiency and precision grinding of hard and brittle difficult-to-machine materials such as natural rocks, engineering ceramics, and semiconductors due to their excellent grinding properties such as high efficiency, stability, and durability. Diamond tools use many diamond abrasive grains under the control of the bond to achieve countless micro-cutting and complete the removal of workpiece material. How to effectively control abrasive particles has always been the research focus of the industry. In the 1990s, Professor A.K.Chattopdhyay of the Indian Institute of Technology first proposed the use of brazing technology to form a chemical metallurgical bond between the diamond and the activ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00B23B27/00
CPCB23B27/00B24D18/0072
Inventor 黄国钦石晓鹏黄辉郭桦徐西鹏
Owner HUAQIAO UNIVERSITY
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