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Method for separating substrate and bearing panel of electronic device and bearing panel

An electronic device and panel technology, applied in the display field, can solve problems such as the deviation of two substrates and the damage of the display panel, and achieve the effects of not being easy to align deviation, non-destructive separation, and not easy to deform

Inactive Publication Date: 2016-10-26
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. While separating the substrate and the load-bearing panel, it will cause the separation of the components of each layer pasted with sealant in the display panel;
[0006] 2. After the first load-bearing panel and one substrate of the display panel are peeled off, when the second load-bearing panel is peeled off, the display panel composed of two ultra-thin glass substrates will undergo huge deformation, which may cause the display panel to deform. damage;
[0007] 3. If there is a horizontal component in the resultant force of the force applied to the load-bearing panel, it will cause the two substrates of the display panel to be displaced

Method used

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  • Method for separating substrate and bearing panel of electronic device and bearing panel
  • Method for separating substrate and bearing panel of electronic device and bearing panel
  • Method for separating substrate and bearing panel of electronic device and bearing panel

Examples

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no. 1 example

[0029] See figure 1 to Figure 4, figure 1 A flow chart showing a method for manufacturing a display panel in a first embodiment of the present invention, figure 2 A schematic structural view of the bearing panel in the first embodiment of the present invention is shown. image 3 A schematic structural view of the lamination of the carrying panel and the first substrate in the first embodiment of the present invention is shown. Figure 4a with Figure 4b A schematic cross-sectional structure diagram and a top view of the display panel formed after the first substrate and the second substrate are covered in the first embodiment of the present invention are respectively shown. Such as figure 1 As shown, in an embodiment of the present invention, the manufacturing method of the display panel includes the following steps:

[0030] Step S10: providing a first substrate, a second substrate and two carrying panels. Specifically, as figure 2 As shown, the carrying panel 1 prov...

no. 2 example

[0042] The second embodiment of the present invention is another embodiment of the method for separating the substrate of the display panel and the carrying panel of the present invention, which is the same as the above-mentioned Figure 5 with Image 6 What is different from the first embodiment shown is that in this embodiment, the carrying panel is separated from the first substrate by applying pressure to the through hole of the carrying panel by using a thimble.

[0043] Please also see Figure 7 with Figure 8 , which respectively show the flow chart of the method for separating the substrate of the display panel and the carrying panel and the structure diagram after inserting the thimble into the through hole of the carrying panel according to the second embodiment of the present invention. Similarly, Figure 8 The method for separating the substrate of the display panel and the carrying panel of the present invention is also described by taking the separation of the...

no. 3 example

[0050] The third embodiment of the present invention is another embodiment of the method for separating the substrate of the display panel from the carrying panel of the present invention, which is the same as the above-mentioned Figure 5 with Image 6 The difference of the first embodiment shown is that in this embodiment, the connection between the bearing panel and the first substrate is achieved by fixing the bearing panel to the opening of a sealed box and increasing the pressure in the sealed box, and the pressure passes through the through hole Transfer to the first substrate to realize the separation between the carrying panel and the first substrate.

[0051] Please also see Figure 9 with Figure 10 , which respectively show the flow chart of the method for separating the substrate of the display panel and the carrying panel and the structural diagram after fixing the carrying panel to the sealing box according to the third embodiment of the present invention. Si...

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Abstract

The invention discloses a method for separating a substrate and a bearing panel of an electronic device and the bearing panel. The bearing panel adopted in the method comprises a laminating area for laminating the substrate of the electronic device, wherein the laminating area comprises a plurality of through holes. The method for separating the substrate and the bearing panel of the electronic device comprises the following step: applying pressure to the plurality of through holes of the bearing panel in order to separate the substrate and the bearing panel of the electronic device. Through adoption of the method for separating the substrate and the bearing panel of the electronic device and the bearing panel for bearing the substrate in the method, lossless separation of the substrate and the bearing panel can be realized, and the manufacturing yield of the electronic device is increased.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for separating a substrate and a carrying panel of an electronic device and a carrying panel used for carrying the substrate in the method. Background technique [0002] Recently, with the development of the information age, the field of display for processing and displaying a large amount of information has also rapidly developed. In particular, thin, light and low-power liquid crystal display panels and OLED display panels have become two mainstream display panels in the field of display panels. [0003] Whether it is a liquid crystal display panel or an OLED display panel, various components are usually formed on two ultra-thin glass substrates during the manufacturing process. Therefore, in order to prevent the deformation of the ultra-thin glass substrate, it is necessary The substrate is attached to a thicker and less deformable carrier panel before the manufactu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67092H01L21/6835H01L2221/68386H01L2221/68318H01L2221/6835
Inventor 丁宗财赵剑张强陈华
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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