A Secondary Coupling Microwave Plasma Reforming Device

A microwave plasma and microwave plasma technology, applied in the field of plasma, can solve the problems of difficult impedance matching, large influence of the impedance of the reaction cavity, etc., and achieve the effect of suppressing stray mode interference and high tolerance

Inactive Publication Date: 2019-03-12
JILIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the plasma can be regarded as a magnetic fluid in the microwave, it has a great influence on the impedance of the reaction chamber. It is generally difficult to achieve impedance matching for two different states simply by matching the impedance of the reaction chamber.

Method used

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  • A Secondary Coupling Microwave Plasma Reforming Device
  • A Secondary Coupling Microwave Plasma Reforming Device
  • A Secondary Coupling Microwave Plasma Reforming Device

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Embodiment Construction

[0044] The present invention will be further described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it with reference to the description.

[0045] Such as figure 1 As shown, the secondary coupling microwave plasma reforming device provided by the present invention includes: a microwave plasma reaction chamber 1001 , a cylindrical resonator 1002 , a plasma reaction tube 1003 , a coupling device 1004 , and an ignition electrode 1005 .

[0046] Wherein, the cavity of the reforming device is a hollow cylindrical cavity placed vertically, surrounded by a circular waveguide 1007 with a rectangular cross section at the center of the cavity, and the circular waveguide 1007 divides the hollow cylindrical cavity into two parts, The ring waveguide 1007 and the outer wall 1006 of the cylindrical cavity form a microwave plasma annular reaction cavity 1001, and the ring waveguide 1007 itself forms a smaller cylindrical resonan...

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Abstract

The invention discloses a secondary-coupling microwave plasma reforming device, which comprises a cylindrical cavity body, an annular waveguide, a microwave plasma reaction tube, a coupling device and an ignition electrode, wherein the annular waveguide surrounds the central position of the cavity body for dividing the cavity body into a cylindrical resonant cavity located in the central position and an external annular reaction cavity, and the annular waveguide is provided with multiple symmetrical and uniformly-distributed coupling windows in the circumferential direction; the microwave plasma reaction tube is arranged in the center of the annular reaction cavity, and mixed gases enter the microwave plasma reaction tube; the coupling device is a quarter-wavelength resonant cavity coupling device and is arranged inside the resonant cavity; and the ignition electrode comprises two metal wires and is connected with a high-voltage power supply and arranged at the gas inlet port of the microwave plasma reaction tube, microwave energy can enter the cylindrical resonant cavity via the coupling device and then enter the annular reaction cavity via the coupling windows, coupling at multiple ports is carried out at the same time, the coupling efficiency is high, and the microwave energy can be distributed more uniformly in the reaction cavity.

Description

technical field [0001] The invention relates to the field of microwave plasma, in particular to a secondary coupling microwave plasma reforming device. Background technique [0002] The microwave plasma reforming device uses microwaves to excite the combustible mixed gas to generate plasma, and through the plasma to promote the reforming reaction of the combustible mixed gas to generate hydrogen-rich gas, which has the advantages of high reaction yield and no need for catalysts. The mechanism of the plasma reforming reaction is to use the high-energy electrons in the plasma to impact the neutral particles in the plasma, so that the neutral particles are cracked to generate active groups (groups). Atomic nuclei or positive ions recombine to form new molecular or atomic structures. Conventional chemical reactions that are difficult to achieve or require expensive heavy metals as catalysts can be easily achieved through plasma reforming reactions. Therefore, the plasma reform...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05H1/30
CPCH05H1/30
Inventor 王军年王岩王治强王庆年李卓
Owner JILIN UNIV
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