Double-sided workpiece polishing apparatus

Abstract

This double-sided workpiece polishing apparatus is provided with a rotating surface plate having an upper surface plate and a lower surface plate, a sun gear, an internal gear, and a carrier plate provided with at least one holder opening for holding the workpiece, and respective polishing pads are affixed on the lower surface of the upper surface plate and the upper surface of the lower surface plate. The apparatus is characterized in that: the upper surface plate or the lower surface plate has at least one pore that pierces the upper surface plate or the lower surface plate from the upper surface to the lower surface; the polishing pads are provided with a hole at the position(s) corresponding to the pore(s); the apparatus is also provided with a workpiece thickness meter capable of measuring the thickness of the workpiece through the one or more pores and holes in real time during double-sided polishing of the workpiece; a recess is provided at the bottom of the side wall of the upper surface plate demarcated by the pore or at the top of the side wall of the lower surface plate demarcated by the pore; a window material with a diameter larger than the diameter of the pore and the diameter of the hole is disposed in the recess; and said window material is fixed via an adhesive layer on the upper surface demarcated by the recess provided in the upper surface plate or on the lower surface demarcated by the recess provided in the lower surface plate.

Description

technical field [0001] The invention relates to a double-side grinding device for workpieces. Background technique [0002] In the manufacture of semiconductor wafers such as silicon wafers, which are typical examples of workpieces to be polished, in order to obtain higher-precision flatness quality and surface roughness quality of the wafer, in general, a method of simultaneously polishing the surface of the wafer is adopted. Two-sided grinding process on the back. [0003] Especially in recent years, due to the miniaturization of semiconductor elements and the increase in the diameter of semiconductor wafers, the flatness requirements of semiconductor wafers during exposure have become stricter, and it is important to complete polishing at an appropriate timing. The operator controls it by adjusting the grinding time. [0004] However, in the adjustment of the grinding time by the operator, it is greatly affected by the grinding environment such as the replacement timing...

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Problems solved by technology

[0004] However, in the adjustment of the grinding time by the operator, it is greatly affected by the grinding environment such as the replacement timing of the grinding auxiliary material and the deviation of the stop timing of the device, and it is not always possible to accurately control the grinding amount. Rely on the operator's experience

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