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Whole plate die attach device and method during production of surface mount type quartz-crystal resonator

A technology for quartz crystals and resonators, which is applied in the field of whole-board mounting devices in the production of surface-mounted quartz crystal resonators. It can solve the problems of low production efficiency, large demand for coating fixtures, and slow circulation, etc., and achieves improved production efficiency and expansion. SMT throughput and the effect of increasing the SMT speed

Active Publication Date: 2016-11-02
SICHUAN MDH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. It takes about 0.6s to pick up and place a single wafer one by one, and 240s to transfer a whole board fixture (taking 400pcs as an example), and the production efficiency is low
[0008] 2. Due to low production efficiency and slow flow, the need for coating fixtures is large

Method used

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  • Whole plate die attach device and method during production of surface mount type quartz-crystal resonator
  • Whole plate die attach device and method during production of surface mount type quartz-crystal resonator
  • Whole plate die attach device and method during production of surface mount type quartz-crystal resonator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] In this embodiment, the rows and columns of the entire wafer on the coating fixture are the same as the row and column spacing of the entire base, that is, after the primer coating process for all the monomer bases on the entire base is completed, all the monomer bases The seat is loaded with the film process at the same time. In this embodiment, the entire wafer on the coating fixture is a P*Q matrix, and the entire base is an M*N matrix, P=M, Q=N. When the entire base is After the left and right platforms of each monomer base are coated with primer, follow the steps below to move and place the entire wafer. The specific loading process is as follows:

[0062] Step 1. Place the entire wafer placed in the coating fixture into the wafer cage, the number of each wafer on the entire wafer, the number of suction nozzles in the suction box, and the number of single bases on the entire base be consistent;

[0063] Step 2. Install the coating fixture with the whole wafer in t...

Embodiment 2

[0069] In this embodiment, the process of moving the entire wafer on the coating jig to the entire base is similar to that of Embodiment 1, except that the array of wafers on the coating jig in this embodiment is the same as that of the entire base. The distance between rows and columns is twice, for the entire wafer on the coating fixture is a P*Q matrix, and the entire base is an M*N matrix, P=2M, Q=2N, that is, all the monomer substrates on the entire base are completed After the primer coating process of the base, the single base located on the entire board of the base with odd rows and columns or even rows and columns is simultaneously subjected to the chip loading process. In this embodiment, the single base with odd rows and odd columns on the entire base is selected first, and then the single base with even rows and even columns on the entire base is coated.

[0070] After the left and right platforms of each single base on the entire base board are coated with primer,...

Embodiment 3

[0079] In this embodiment, the process of moving the entire plate wafer on the coating fixture to the entire base plate is similar to Embodiment 1, the difference is that in this embodiment, the coating fixture is installed in the suction box, and the suction box is turned over. All done manually.

[0080] In addition, in this embodiment, the rows and columns of the entire wafer on the coating fixture are three times the row-column spacing of the entire base. For the entire wafer on the coating fixture, it is a P*Q matrix, and the entire base is an M*N matrix. P = 3M, Q = 3N, that is, after the primer coating process of all monomer bases on the entire base board is completed, the monomer bases on the entire base board separated by two rows and two columns are simultaneously applied. piece craft. Taking the 12*12 base board as an example, in this embodiment, the first, 4th, 7th, and 10th rows and 1st, 4th, 7th, and 10th rows of the base board are first selected. Put on the fi...

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Abstract

The invention belongs to the field of electronic components, and particularly relates to a whole plate die attach device and a method thereof during the production of a surface mount type quartz-crystal resonator. The whole plate die attach device comprises a fixing device, an adsorption device located in the fixing device, a moving device detachably connected with the fixing device, and whole plate wafers arranged on the moving device and configured to be attached to a substrate whole plate. The whole plate wafers are composed of a plurality of wafers. The adsorption device is in contact with the whole plate wafers arranged on the moving device. According to the technical scheme of the invention, the whole plate die attach method comprises the steps of integrally moving the plurality of wafers to form the whole plate wafers, and providing a single substrate corresponding to each wafer of the whole plate wafers right below the wafer. The wafers are absorbed and clamped integrally by a film-coating fixture and then are integrally placed on the substrate whole plate after the dispensing process. Therefore, the wafer placement time is shortened and the wafer mounting speed is high. Meanwhile, the production efficiency is improved by hundreds of times, and the production capacity is expanded.

Description

technical field [0001] The invention belongs to the field of electronic components, and in particular relates to a whole-board mounting device and method in the production of surface-mounted quartz crystal resonators. Background technique [0002] Quartz crystal resonator, also known as quartz crystal, commonly known as crystal oscillator, is a resonator made by using the piezoelectric effect of quartz crystal. It can be used together with semiconductor devices and resistance-capacitance components to form a quartz crystal oscillator. [0003] Quartz wafer, hereinafter referred to as wafer, it can be square, rectangular or circular, etc., coated with silver layer on its two corresponding surfaces as electrodes, surface-mounted quartz crystal resonator is the electrode on the quartz wafer through conductive glue Conduct electrical connection with the base, apply primer on the base to form conductive adhesive under the quartz wafer, place the quartz wafer above the primer, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H9/19
CPCH03H3/02H03H9/19
Inventor 黄屹李斌
Owner SICHUAN MDH TECH CO LTD
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