Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper deposits
A copper electroplating and acid technology, applied in the field of copper electroplating bath, can solve the problems of high ductility and low internal stress
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example 1
[0045] Prepare the following aqueous acidic copper electroplating baths at room temperature.
[0046] surface
[0047]
[0048] 1 PolyMax TM pA-66 / LC (available from Heritageplastics, Inc. Picayune, MS)
[0049] 2 PEG 12000
[0050] The composition of the copper electroplating baths was made using conventional laboratory procedures in which the organics were added to the water followed by the addition of the inorganic components. Stirring or agitation with heating is performed at a temperature below 30°C to ensure that all components are dissolved in the water. The bath was allowed to come to room temperature prior to copper plating. The acidic copper electroplating bath has a pH in the range of less than 1 to 1 at room temperature and during copper electroplating.
example 2
[0052] Two flexible copper / beryllium alloy foil test strips were dielectric coated on one side, enabling single-sided plating on the uncoated side. The test strips were taped to a support substrate with plating tape and placed in a Harlem cell containing an acidic copper plating bath with the bath 1 recipe. The bath is at room temperature. A strip of copper metal is used as the anode. Connect the test foil strip and anode to the rectifier. The test foil strips were copper plated at an average current density of 2ASD to deposit a copper thickness of 5 μm on the uncoated side of each strip. After plating was complete, the test strips were removed from the Harlem cell, rinsed with water, dried and the plating tape was removed from the test strips. Insert one end of the test strip into the screw clamp of a Sediment Stress Analyzer (available from Professional Testing and Development, Jacobs, PA). The test strips are at room temperature. The internal stress of the copper depos...
example 3
[0055] Two flexible copper / beryllium alloy foil test strips were dielectric coated on one side, enabling single-sided plating on the uncoated side. The test strips were taped to a support substrate with plating tape and placed in a Harlem cell containing an acidic copper plating bath with the bath 2 recipe. The bath is at room temperature. A strip of copper metal is used as the anode. The test foil strip and the anode will be connected to the rectifier. The test foil strips were copper plated at an average current density of 2ASD to deposit a copper thickness of 5 μm on the uncoated side of each strip. After plating was complete, the test strips were removed from the Harlem cell, rinsed with water, dried and the plating tape was removed from the test strips. Insert one end of the test strip into the screw clamp of the Sediment Stress Analyzer. The internal stress of the copper deposit on the strip was determined to be 503 psi. Internal stress can be determined using the e...
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