Connection device and communication method used for communication between master module and slave module

Abstract

The invention discloses a connection device used for communication between a master module and a slave module. The connection device comprises a master module communication line socket, a slave module recognition line socket, a master module address line socket, a slave module communication line socket, a pluggable recognition line socket and a slave module address line socket, wherein short connection is conducted to the communication line socket; the slave module recognition line socket is connected to the pluggable recognition line socket; and the master module address line socket and the slave module address line socket apply high-level and low-level combinations at connecting points in the sockets so as to obtain different sequences of high levels and low levels of the sockets, so that a master module communication address is different from a slave module communication address. The invention also discloses a communication method which applies the connection device to implement the communication. The method comprises the steps that the master module and the slave module are connected; the communication addresses are read; the master module receives and stores the slave module communication address; a low level is disposed at the pluggable recognition line socket of the slave module; the master module judges whether the slave module is connected to a slot; and the communication is implemented between the master module and the slave module. The device disclosed by the invention implements a plug-and-play function of the slave module. The method disclosed by the invention has the advantages that the communication speed is high; and the plug-and-play function of the slave module is supported.

Description

technical field [0001] The invention belongs to the field of electronic technology, and in particular relates to a connection device and a communication method for master-slave module communication. Background technique [0002] With the development of economy and technology and the improvement of people's living standards, the social division of labor is becoming more and more detailed. Along with a more refined social division of labor, electronic products have gradually begun the process of modularization. After the electronic product is modularized, each sub-module completes a relatively independent function, and works uniformly under the scheduling of the main module; the sub-module and the main module, and between sub-modules and sub-modules complete data interaction through communication. After the modular design of electronic products, it is more conducive to the production and assembly of electronic products, and the maintenance and replacement of products are very...

AI Technical Summary

Problems solved by technology

However, the modular design also brings certain problems: when the product is debugged or assembled after assembly, due to the inconvenient setting of the communication address, it is difficult to debug the product and the debugging cycle is relatively long

It is inconvenient to use the program to fix the address, and the application operation is difficult, and the maintenance is difficult; and the jumper is used to fix the address, and its reliability is low. For the identification of the plug-in board, it usually depends on the repeated communication inquiry of the module and then fails to answer many times. to make sure

It is easy to block the communication bus and adversely affect the operation of the equipment

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