Embedded high-thermal conductive PCB and manufacturing method thereof

Abstract

The invention relates to a high-thermal conductive printed circuit board (PCB) with an embedded type. The PCB comprises a PCB multilayer board and a thermal conductive element, wherein the thermal conductive element is embedded into the PCB multilayer board. The PCB multilayer board is formed by an inner core plate, a prepreg and an external core plate by a stitching mode. The thermal conductive element has an embedded part that do not penetrate one side of the external core plate and a part of the inner core plate. a through hole, that is corresponded to the embedded part of the thermal conductive element and penetrates the external core plate, the inner core plate and the embedded part of the thermal conductive element, is arranged on the PCB multilayer board. A hole wall of the through hole is plated with a copper plating layer by copper deposition. And conducting layers of the inner core plate and the external core plate and the thermal conductive element are in thermal conductive connection and conductive connection by the copper plating layer. According to the embedded high-thermal conductive PCB provided in the invention, a thermal conductive element is embedded into a PCB multilayer board, so that functions of high heat dissipation and high speed signal transmission and the like are realized; moreover, a hole wall of a through hole is plated with a copper plating layer, so that conducting layers of an inner core plate and an external core plate and the thermal conductive element are in thermal conductive connection and conductive connection. In addition, the invention also relates to a manufacturing method for the embedded high-thermal conductive PCB.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards (Printed Circuit Board, PCB), in particular to an embedded high thermal conductivity PCB and a manufacturing method thereof. Background technique [0002] With the widespread use of high-frequency electronic signals, the heat generated by the components of the chip on the printed circuit board (PCB), especially the heat generated by the high-power components will cause great damage to the components, which needs to be used Heat dissipation or cooling methods help to dissipate heat, so it is necessary to design an effective heat dissipation method on the PCB to dissipate the high heat generated by the power amplifier components at any time. The traditional method is to weld a large heat sink on the back of the entire PCB to dissipate heat from the power amplifier components. However, due to the high dielectric constant (Dk) of the material used for the heat sink and the fact tha...

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Problems solved by technology

However, due to the high dielectric constant (Dk) of the material used for the heat sink and the fact that the heat sink is not grounded, the loss of electrical signal transmission will be great; Many factors will affect the heat dissipation effect; the PCB board made by welding the heat sink is large in size, which increases the space of the whole equipment; the welding heat sink cannot effectively dissipate heat on the inner core board

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