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Substrate position recognition processing method of laser scribing machine image recognition system

A laser scribing machine and image recognition technology, which is applied in the field of image processing, can solve the problems that the recognition method cannot meet the scribing requirements, and achieve the effect of eliminating edge interference, ensuring error-free recognition, and good reliability

Active Publication Date: 2018-07-13
中科长光精拓智能装备(苏州)有限公司
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  • Application Information

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Problems solved by technology

Due to the high accuracy of the scribing position of the equipment, which is ±3μm, the recognition accuracy of the Mark point is not higher than ±2μm. Due to the diversity and instability of the scribing process, multiple interference points and two Mark points, so the traditional template matching recognition method cannot meet the actual scribing requirements

Method used

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  • Substrate position recognition processing method of laser scribing machine image recognition system
  • Substrate position recognition processing method of laser scribing machine image recognition system
  • Substrate position recognition processing method of laser scribing machine image recognition system

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Embodiment Construction

[0033] The image recognition system of the present invention is as follows:

[0034] Such as figure 1 As shown, the industrial computer 1 controls the movement of the slide table 4 to move the substrate to the position of the CCD camera 3, and makes the Mark point on the substrate enter the field of view of the CCD camera 3; signal, the industrial computer 1 triggers the CCD camera 3 to collect an image, such as image 3 shown. The image data is transmitted to the industrial computer 1 via the image acquisition card 2, and the industrial computer 1 performs the following processing after obtaining the image data, as figure 2 Shown:

[0035] Step 1. Acquisition image judgment:

[0036] Since the collected image is formed by laser cutting the ceramic substrate, affected by the process and environment during the cutting process, a small part of the substrate has dust attached to the substrate and the Mark point, causing noise interference to the image recognition. Therefore,...

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Abstract

The invention relates to a substrate position identification processing method for an image identification system of a laser scribing machine. The method comprises the following steps of performing binary processing on an acquired whole image; performing edge detection on a Mark point of the image to obtain horizontal and vertical central point lines of a cross; detecting a central line of the Mark point, transforming central points on the central point lines of the cross into sine lines of a rectangular coordinate system parameter space, transforming solving of a straight line into solving of polar coordinate parameters of an intersection point between the sine lines, and obtaining polar coordinate parameters of the horizontal line and the vertical line of the cross; and obtaining polar coordinates of an intersection point of the cross according to the polar coordinate parameters of the horizontal line and the vertical line of the cross. The method is high in identification precision and high in reliability, and can be suitable for a device required to be subjected to image identification processing, such as the laser scribing machine, a laser cutting machine or the like.

Description

technical field [0001] The invention belongs to the technical field of image processing, and relates to a substrate position recognition processing method of a laser scribing machine image recognition system. Background technique [0002] In order to improve the quality of workpieces, reduce processing time, and reduce processing costs, laser technology has emerged and received widespread attention, and has been gradually applied to the fields of manufacturing, surface treatment, and material processing. The laser scribing machine is a special equipment in the manufacture of passive component resistance substrates. The image recognition system of the equipment is used to automatically determine the position of the scribing substrate, so that the light emitting position is completely aligned with the substrate position. Due to the high accuracy of the scribing position of the equipment, which is ±3μm, the recognition accuracy of the Mark point is not higher than ±2μm. Due to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00G06T7/13
CPCG06T7/0006G06T2207/10004
Inventor 邢鹏展王忠生钱雨松刘遵明吴梦晗郑福志徐丽萍梁崑王星郭尧杨蒙赵锋锋
Owner 中科长光精拓智能装备(苏州)有限公司