PCB and mobile terminal possessing the PCB
A PCB board and mobile terminal technology, applied in the reduction of crosstalk/noise/electromagnetic interference (, circuit devices, printed circuit components, etc., can solve the problems of mutual signal interference and affecting the normal operation of PCB boards, etc., to improve reliability , reduce mutual interference and improve performance
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Embodiment 1
[0036] Such as figure 1 As shown, the PCB board 100 according to the embodiment of the present invention includes multiple conductive layers stacked on top of each other. The multi-layer conductive layer includes a first conductive layer and a second conductive layer adjacent to the first conductive layer. On the first conductive layer The first wiring line 1 is laid, the second wiring line 2 is arranged on the second conductive layer, the area of the first wiring line 1 is S, and the projection of the second wiring line 2 on the first conductive layer overlaps with the first wiring line 1 The area of is S', S and S' satisfy: 1 / 4≤S' / S≤3 / 5.
[0037]The angle between the extending direction of the first wiring line 1 and the extending direction of the second wiring line 2 is α, where α=90°, that is, the first wiring line 1 and the second wiring line 2 are vertically arranged. The first wiring line 1 extends in the horizontal direction, the second wiring line 2 extends in th...
Embodiment 2
[0039] Such as figure 2 As shown, the structure of this embodiment is substantially the same as that of Embodiment 1, except that the extension direction of the first wiring line 1 is the same as that of the second wiring line 2, and the second wiring line 2 is on the first conductive layer. The projection of is located on one side of the first wiring line 1, and the signal interference between the first conductive layer and the second conductive layer only occurs on one side of the first wiring line 1, which greatly reduces the gap between the first conductive layer and the second conductive layer. signal interference, improve the quality of signal transmission, and improve the performance of the product.
[0040] At the same time, during the pressing process, the first conductive layer and the second conductive layer will not form a large gap, ensuring that the connection between the first conductive layer and the second conductive layer will not be cut off during the PCB p...
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