Liquid cooling cold plate and manufacturing method thereof

A technology of liquid-cooled cold plate and manufacturing method, which is applied in the direction of cooling/ventilation/heating transformation, electrical equipment structural parts, electrical components, etc., and can solve problems such as high heat flux density, influence on the operation of electronic equipment, and overheating damage to electronic equipment. Achieve high heat dissipation efficiency, improve heat dissipation efficiency, and increase heat dissipation efficiency

Inactive Publication Date: 2016-11-09
CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The improvement of the performance of electronic equipment will inevitably increase the power of electronic equipment, which will lead to an increase in the heat flux density in electronic equipmen

Method used

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  • Liquid cooling cold plate and manufacturing method thereof
  • Liquid cooling cold plate and manufacturing method thereof
  • Liquid cooling cold plate and manufacturing method thereof

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Embodiment Construction

[0015] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0016] A specific embodiment of the liquid-cooled cold plate of the present invention, such as Figure 1 to Figure 3 As shown, the liquid-cooled cold plate includes a base plate 21 and a cover plate 22. A plurality of flow channels 22 are arranged side by side on the base plate 21. The flow channels 22 are capillary flow channels. Here, the capillary flow channels refer to the smaller size of the flow channels. , specifically, the depth is 1mm~2mm, and the width is 0.3mm~3mm, which can further increase the distribution density of the runners. These runners are parallel to each other and distributed on the substrate 21 in a spiral manner. The flow channel 22 is a rectangular groove with a rectangular cross-section, and the starting ends of each flow channel are collected together and communicated with the liquid inlet 23 and the liquid outlet 24 of the co...

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Abstract

The invention relates to a liquid cooling cold plate and a manufacturing method thereof. In a liquid cooling cold plate machining process, flow channels are machined on a substrate; and the substrate and a cover plate are bonded to each other and then are connected together through vacuum diffusion welding, so that the bonding surfaces of the substrate and the cover plate can be in sealing connection. In a welding process, the substrate and the cover plate are connected through the bonding surfaces, and a space for welding is not needed to be left, and therefore, the distribution density of the flow channels on the substrate is not affected by welding, and the distribution area of the flow channels is increased, and the heat dissipation efficiency of the cold plate can be improved. In a vacuum diffusion welding process, weld joints are flat, and therefore, welding slag will not be generated in the welding process, the clogging of the flow channels caused by the welding slag can be avoided, the flowing resistance of liquid in the flow channels can be decreased, and the flowing speed of the liquid in the flow channels can be increased, and as a result, the heat dissipation efficiency of the cold plate can be further improved. The liquid cooling cold plate has high heat dissipation efficiency and can carry out efficient heat dissipation on electronic devices.

Description

technical field [0001] The invention relates to a liquid-cooled cold plate and a manufacturing method thereof. Background technique [0002] With the development of science and technology, the performance of electronic equipment is also continuously enhanced. The improvement of the performance of electronic equipment will inevitably increase the power of electronic equipment, which will lead to an increase in the heat flux density in electronic equipment. If the electronic equipment is not cooled in time, the operation of electronic equipment will be seriously affected, and even the electronic equipment will be damaged. The device is damaged by overheating. Therefore, there is an urgent need for a device capable of efficiently dissipating heat from electronic equipment. Contents of the invention [0003] The object of the present invention is to provide a liquid-cooled cold plate capable of efficiently dissipating heat; meanwhile, the present invention also provides a me...

Claims

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Application Information

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IPC IPC(8): H05K7/20B23P15/00
CPCH05K7/20272B23P15/00
Inventor 黄胜利叶亚鹏高长松
Owner CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
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