Array backboard circuit and manufacturing method thereof

Abstract

The invention discloses an array backboard circuit and a manufacturing method thereof. The array backboard circuit is composed of a driving signal bus, a data signal bus, a grounding bus and a plurality of unit circuits, wherein each unit circuit comprises an insulated substrate, a gate electrode, a common electrode, a gate insulating layer, a source electrode, a drain electrode, an electrode modification material, an organic semiconductor layer, an interlayer insulating film, a lower pixel electrode, a display material and an upper pixel electrode; and the manufacturing method realizes all manufacturing processes of a device of the array backboard circuit via an all-solution method, each functional layer of the array backboard circuit is printed in sequence according to an addition process flow by adopting an ink-jet printing method, and a patterned and penetrated structure of a thin film is realized at the same time. The array backboard circuit has the advantages that the process is simple and convenient, materials are saved, the titration is accurate, large-area integration is easy to realize, and equipment and production costs are greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of organic electronics, and in particular relates to an array backplane circuit based on a full inkjet printing process and a preparation method thereof. Background technique [0002] Due to the advantages of low process cost, low-temperature preparation, easy flexibility and large-area integration, printed electronics technology has attracted widespread attention. Wide application prospects, especially in the field of array backplane circuit research and development. With the increasing demand for low-cost and flexible display devices, the preparation of array backplane circuits by solution method will have further development and application. [0003] At this stage, there are few reports on the process of fabricating array backplane circuits by the solution method at home and abroad. The traditional array backplane circuit preparation process cannot simultaneously achieve the effects of material saving, ac...

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Problems solved by technology

[0003] At this stage, there are few reports on the process of manufacturing array backplane circuits by solution method at home and abroad. The traditional array backplane circuit preparation process cannot simultaneously achieve the effects of material saving, accurate titration, no need for additional via technology, and easy large-area integration. The immaturity of the solution manufacturing process itself further limits its industrialization process

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