T-shaped air duct cooling device applying trapezoid cooling fins

A heat dissipation device and heat sink technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve problems such as temperature imbalance, achieve balanced heat dissipation, reduce flow resistance, and shorten flow paths Effect

Active Publication Date: 2016-11-16
SHAANXI HUANGHE GROUP
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Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a T-shaped air duct heat dissipation device using t

Method used

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  • T-shaped air duct cooling device applying trapezoid cooling fins
  • T-shaped air duct cooling device applying trapezoid cooling fins
  • T-shaped air duct cooling device applying trapezoid cooling fins

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[0018] The present invention will be further described below with reference to the drawings and embodiments. The present invention includes but is not limited to the following embodiments.

[0019] The T-shaped air duct heat dissipation device using trapezoidal radiating fins provided by the present invention includes a casing, a rectangular parallelepiped radiator, an L-shaped square tube and an exhaust fan.

[0020] The rectangular parallelepiped radiator is a hollow cuboid, and its axial ends are open as an air inlet, and an air outlet is opened in the middle of the side wall; a plurality of trapezoidal heat sinks are fixed evenly on the two opposite side walls of the inner cavity of the rectangular parallelepiped radiator The two side walls and the side wall where the air outlet is located are perpendicular to each other, the trapezoidal heat sink is divided into two vertical sections, and the section perpendicular to the side wall where the air outlet is located is a rectangula...

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PUM

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Abstract

The invention provides a T-shaped air duct cooling device applying trapezoid cooling fins. The T-shaped air duct cooling device comprises a shell, a cubic heat sink, an L-shaped square pipe and an air suction fan, wherein the cubic heat sink is a hollow cuboid, air inlets are arranged at two axial ends, an air outlet is formed in a side wall, a plurality of trapezoid cooling fins are fixedly arranged on two side walls, opposite and perpendicular to the air outlet, of an inner cavity of the trapezoid cooling fins and are arranged uniformly, a rectangular plate is arranged at one segment, perpendicularly facing the air outlet, of each trapezoid cooling fin, a right trapezoid plate is arranged at one segment parallel to the air outlet, an upper bottom edge of the right trapezoid plate perpendicularly faces the air inlet near to the rectangular plate, the air outlet is communicated with the air suction fan through the L-shaped square pipe, T/R modules are arranged at outer sides, fixedly connected with the trapezoid cooling fins, of two side walls, and the T/R modules are sealed between the air inlets and the air outlet of the heat sink. The T-shaped air duct cooling device has the advantages of simplicity in structure, small size, light weight and balanced cooling effect, and is easy to process, and the three-protection requirement of an active phased array radar can be met.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic equipment, in particular to a heat dissipation device of a T / R component in an active phased array radar. Background technique [0002] Any electronic equipment must be stored or worked under certain environmental conditions, and the influence of temperature on electronic equipment is particularly important. The T / R component in the active phased array radar puts forward high requirements for cooling and thermal control. Feasible cooling methods and excellent cooling effects have become one of the important foundations for radars to meet the requirements of high reliability indicators. The heat dissipation methods currently applied to T / R components mainly include forced liquid cooling and forced air cooling. The structure of forced liquid cooling is more complicated, and a complete liquid cooling system is required. Its weight and volume are relatively large, and it is not suitable ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20145H05K7/20154
Inventor 庄少华刘卫刚何云锋
Owner SHAANXI HUANGHE GROUP
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