Heating device

Abstract

The invention provides a heating device, comprising an ultrasound temperature measurement module, and a wireless communication module. The ultrasound temperature measurement module is arranged in a cookware. The ultrasound temperature measurement module is used to test working condition temperature of the cookware. The wireless communication module is connected with the ultrasound temperature measurement module. Assemblies of the wireless communication module are separately arranged in the cookware and in a stove, and the assemblies are used to obtain the working condition temperature, so as to control the stove to adjust heating power according to the working condition temperature. Through the technical scheme, wireless accurate temperature measurement on the working condition temperature of the heating device is realized, and the structure of the heating device is simplified, so as to improve convenience of user operation, and further improve user experience.

Description

technical field [0001] The present invention relates to the technical field of household appliances, and more specifically, to a heating device. Background technique [0002] In related technologies, resistance temperature sensors are usually used for contact temperature measurement of heating devices, but there are many disadvantages: [0003] (1) The contact temperature measurement is based on the heat conduction effect, which will cause heat loss during the heat conduction process and reduce the measured signal; [0004] (2) Contact temperature measurement has high requirements on the position of the heating device under test. Once the heating device under test is far away from the resistive temperature sensor, it may affect the accuracy of the test results; [0005] (3) The heat dissipation process of the resistance temperature sensor is slow, which seriously affects the dynamic response characteristics of the test process. [0006] Therefore, how to design a heating d...

AI Technical Summary

Problems solved by technology

[0003] (1) The contact temperature measurement is based on the heat conduction effect, which will cause heat loss during the heat conduction process and reduce the measured signal;

[0004] (2) Contact temperature measurement has high requirements on the position of the heating device under test. Once the heating device under test is far away from the resistive temperature sensor, it may affect the accuracy of the test results;

[0005] (3) The heat dissipation process of the resistive temperature sensor is slow, which seriously affects the dynamic response characteristics of the test process

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