Wafer support ring, wafer support jig and wafer processing equipment

Abstract

A wafer supporting ring comprises a supporting ring body, the supporting ring body comprises an outer ring part and an inner ring part, the height of the inner ring part is smaller than that of the outer ring part, and the outer side of the upper surface of the inner ring part and the inner side of the upper surface of the outer ring part are in transition connection through a slope. A wafer supporting clamp comprises a reinforcing ring, connecting rods and the wafer supporting ring, the reinforcing ring is located below the supporting ring body, the upper ends of the connecting rods are fixedly connected with the supporting ring body, and the lower ends of the connecting rods are fixedly connected with the reinforcing ring. Wafer processing equipment comprises a heating plate, a wafer carrying plate is arranged on the upper surface of the heating plate, the wafer processing equipment further comprises the wafer supporting clamp and a driving device used for driving the wafer supporting clamp to move vertically, the supporting ring body is located above the wafer carrying plate, the reinforcing ring is located below the heating plate, the driving device is connected with the reinforcing ring, the connecting rods penetrate through the heating plate, and the height of the wafer carrying plate is not smaller than that of the inner ring part. The wafer supporting ring has the advantages of being simple in structure, convenient to use, uniform in stress, good in supporting stability and the like.

Description

technical field [0001] The invention relates to equipment for manufacturing semiconductors, in particular to a wafer support ring, a wafer support fixture and wafer processing equipment. Background technique [0002] The integrated circuit and semiconductor manufacturing industries promote the realization of equipment automation. The function of some semiconductor equipment is to process the wafer through physical and chemical means. This process is called semiconductor process. Most of the semiconductor process is in a vacuum sealed reaction chamber. Therefore, it is necessary to accurately transfer the wafer to be processed into the reaction chamber and position it accurately. [0003] At present, most of the semiconductor processes use manipulators to transfer wafers or trays into the reaction chamber, and then remove the wafers or trays from the reaction chamber after processing. The pick-and-place process is usually achieved by the cooperation of manipulators and thimbl...

AI Technical Summary

Problems solved by technology

This positioning method needs to adjust the tops of each thimble to the same height. The adjustment process is very cumbersome and the accuracy cannot be guaranteed. It is also difficult to keep at the same height during use; It is easy to cause debris during the process; in addition, the area supported by the thimble is generally in the area where the chip is made on the wafer. When the process needs to heat the wafer, the thimble will affect the temperature of the wafer surface, and it is impossible to ensure that the temperature of each area of ​​the wafer is consistent. The yield rate of the chip is reduced

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