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waterproof plate

A waterproof sheet and ground technology, which is applied to the frame of the engine, electrical components, supporting machines, etc., can solve the problems of low efficiency, cumbersome large-scale operations, inconvenient handling by operators of weight and size, and achieve the effect of easy setting.

Active Publication Date: 2021-06-18
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The waterproof pan used in the above-mentioned processing equipment is installed between a heavy equipment and the ground, which requires sufficient rigidity not to deform or cause cracks due to the weight when the equipment is installed, and it is difficult to generate water caused by water leakage. Due to the properties of rust, etc., it is usually made of metal such as stainless steel, and its weight and size are inconvenient for operators to carry
[0009] In addition, in the case of using the existing waterproof pan, in order to install it directly under the installed processing equipment from the rear, it is necessary to lift the entire device with a crane or the like so that the waterproof pan submerges in the space below it. thus becoming a large job and very cumbersome
Furthermore, the sizes of various processing devices are different from each other. Therefore, if waterproof pans are made according to each shape and size of each device, waterproof pans that conform to the shape of the bottom surface of the processing devices have to be manufactured one by one, which is inefficient in terms of manufacturing costs. Not very good

Method used

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Embodiment Construction

[0026] Hereinafter, a first embodiment of the waterproof pan according to the present invention will be described in detail with reference to the drawings.

[0027] figure 1 A perspective view showing a cutting device (cutting device) and an embodiment in which a waterproof pan according to the present invention is disposed under the cutting device.

[0028] The semiconductor wafer W supported on the frame F via the holding belt T is stored in the magazine 11 in a stacked manner, and is carried out from the magazine 11 by the loading and unloading unit 12, and is sucked by the first transportation unit 13, and passed through The first transport unit 13 is placed on the chuck table 16 while performing a swivel motion.

[0029] When the semiconductor wafer W is sucked and held on the chuck table 16, it moves toward the rotary tool 17, passes through the calibration unit halfway to determine the area to be cut, and then aligns with the rotary tool 17, and then moves the chuck ta...

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Abstract

The invention provides a waterproof pan, which can simplify the structure of the waterproof pan, ensure the performance as the waterproof pan, and facilitate the transportation and installation of the waterproof pan. The waterproof plate of the present invention is arranged on the lower surface of the device installed on the ground to receive the leaked liquid from the device, and it is composed of at least: a waterproof sheet, which is laid on the ground and has flexibility; a plurality of frames body, they respectively have the rigidity that supports the outer peripheral side wall formed by bending and erecting the outer periphery of the waterproof sheet; fixed.

Description

technical field [0001] The present invention relates to a waterproof pan arranged at the lower part of a device that uses processing water when processing a workpiece. Background technique [0002] In the manufacturing process of semiconductor devices, a plurality of regions are divided by dividing lines arranged in a grid pattern on the surface of a substantially disk-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in the divided regions. Then, the back surface of the semiconductor wafer on which the device is formed is ground to a predetermined thickness by a grinding device, and the semiconductor wafer is cut by a dicing device along a planned dividing line, thereby dividing the region where the device is formed to manufacture individual semiconductor devices. . [0003] The above-mentioned grinding apparatus and cutting apparatus generally use processing water such as grinding water and cutting water during processing, and the supply and recovery...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/67155H01L21/02H01L21/67005H01L21/78F16M1/00
Inventor 俞晨曦陆昕
Owner DISCO CORP