Hot melting machine for multilayer printed circuit board
A multi-layer printing and circuit board technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of increasing manufacturing cost, space placement cost, long machine length, unfavorable improvement of product competitiveness, etc. The effect of shortened length and volume reduction
Inactive Publication Date: 2016-12-07
PAN TEC CORP
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Problems solved by technology
As a result, the length of the entire machine is long. In today's narrow and densely populated environment, the bulky machine will increase manufacturing costs and space placement costs, which is not conducive to improving product competitiveness.
Method used
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[0040] The present invention is a kind of hot-melt machine of multi-layer printed circuit board, please refer to figure 1 , figure 2 As shown, a body (10) is provided with a first lower welding part (20) at both ends, a second lower welding part (201) adjacent to the first lower welding part (20), and a (10) An upper welding part (30) which can be displaced left and right to face the first and second lower welding parts (20) (201) respectively.
[0041] please see again figure 2 , image 3 As shown, the first and second lower welding parts (20) (201) have the same shape, wherein a horizontal frame (21) is fixed at an appropriate height of the body (10), and a substrate is laid on the frame (21) (22), the first and second lower welding parts (20) (201) are respectively provided at both ends of the lower substrate (22), and the first and second lower welding parts (20) (201) respectively include a plurality of lower welding parts Head (23), such as eight lower welding join...
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The present invention is a hot melting machine of multi-layer printed circuit board (PCB). The machine body of the hot melting machine has: a first lower fusing part; the second fusing part adjacent to the first lower fusing part; and an upper fusing part mounted on the machine body to shift in the left-right direction on the first and second lower fusing parts. Both sides of the first and second fusing parts have a sliding rail respectively, the upper fusing part has the corresponding sliding member on both sides. The length of the upper fusing part is right the length of the first or second fusing part. The bottom of the upper fusing part is connected to the power source located under the machine body, the power source pushes the upper fusing part to shift in the left-right direction. Therefore, on the condition that the length of machine body is shortened, the upper fusing part moves alternatively to the positions of the first and second fusing parts through the power source, so that the upper fusing head of the upper fusing part moves downward at a fixed point, thereby aligning with the multi-layer PCB of the first and second fusing parts for Hot melt Press fit.
Description
technical field [0001] The invention relates to a hot-melt machine suitable for lamination of multi-layer printed circuit boards, in particular, the structure change of the hot-melt machine reduces the volume of the body and improves the operation efficiency of hot-melt lamination of multi-layer printed circuit boards. Background technique [0002] Printed Circuit Board (PCB) is made into a multilayer circuit board with more than three layers, which is the current trend, and PCB products will mostly develop towards high-density thin board (HDI) or multilayer (Multilayer) type. Therefore, in the lamination process of each printed circuit board, the alignment accuracy of each layer must be required. Therefore, the lamination technology of printed circuit boards has been developed from the previous riveting method to the electromagnetic induction hot-melt machine. It is mainly to place the inner layer and the film on the operating table of the hot melt machine after alignment, ...
Claims
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Inventor 郭添富
Owner PAN TEC CORP