Communication type piezoresistive array

An array and electrode array technology, applied in the field of sensors, can solve problems such as the inability to detect pressure and the need to expand the measurement area, and achieve the effects of eliminating measurement blind areas, improving use efficiency and reliability, and expanding the measurement area

Inactive Publication Date: 2016-12-21
CENT SOUTH UNIV
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

Therefore, the traditional sensor array cannot detect the pressure acting between the sensing subunits (that is, there is a blind zone), and its measurement area needs to be expanded

Method used

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  • Communication type piezoresistive array
  • Communication type piezoresistive array
  • Communication type piezoresistive array

Examples

Experimental program
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Effect test

Embodiment

[0013] Lay 3 rows and 3 columns of copper electrode arrays on the surface of a polyimide film as the outer insulating film of the underlying packaging film; open a window on another polyimide film as the inner insulating film of the underlying packaging film, the inner The number and size of the windows on the insulating film are the same as those of the electrodes on the outer insulating film; the inner insulating film with windows and the outer insulating film covered with electrode arrays are laminated together to form the bottom packaging film, and ensure that all The electrodes and the windows are aligned one by one so that all the electrodes are exposed; the carbon black powder and polydimethylsiloxane are mixed by the solution mixing method, and the mass ratio is 0.08:1, and the carbon black is made by extrusion molding Fill the polydimethylsiloxane composite film; cut the carbon black filled polydimethylsiloxane composite film as the piezoresistive sensitive film, so th...

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Abstract

The invention relates to a communication type piezoresistive array, belonging to the technical field of sensors. The communication type piezoresistive array comprises a bottom layer packaging film, a top layer packaging film, and a piezoresistive sensitive film between the bottom layer packaging film and the top layer packaging film. The bottom layer packaging film is formed by an inner side insulation film with a window and an outer side insulation film covered by an electrode array. The structure, size and electrode number of the top layer packaging film are the same with that of the bottom layer packaging film. The sensing sub unit total number of the communication type piezoresistive array is the same with the electrode number of the bottom layer packaging film. Two output signal ends of each sensing sub unit are the electrode of the bottom layer packaging film and the electrode of the top layer packaging film opposite to the bottom layer packaging film. One piezoresistive film is shared by all sensing sub units in the communication type piezoresistive array, and force which acts on any one area in the communication type piezoresistive array causes the change of all sensing sub unit output signals. By using the communication type piezoresistive array designed in the invention, a measurement blind area can be eliminated, and the measurement area of the piezoresistive array can be expanded.

Description

technical field [0001] The invention belongs to the technical field of sensors, in particular to sensor arrays and pressure measurement. Background technique [0002] With the development of science and technology, array sensors have been widely used in modern engineering. For example, a pressure sensor array using the piezoresistive effect of conductive polymer composites. However, the traditional sensor array is a non-connected array, that is, each sensing subunit is separated, and there is no piezoresistive sensitive material between the sensing subunits. Therefore, the traditional sensor array cannot detect the pressure acting between the sensing sub-units (that is, there is a blind area), and its measurement area needs to be expanded. Contents of the invention [0003] The object of the present invention is to propose a connected piezoresistive array in order to overcome the shortcomings of the prior art. The connected piezoresistive array includes a bottom packagi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/18
CPCG01L1/18
Inventor 王璐珩
Owner CENT SOUTH UNIV
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