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A plugging device for solder paste printing nozzle

A technology of nozzles and solder paste, which is applied in printed circuits, printed circuit manufacturing, and electrical component assembly of printed circuits. The effect of easy disassembly

Active Publication Date: 2018-12-11
SUZHOU SOLDER FORCE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a solder paste printing nozzle blocking device to solve the problem that the nozzle of the jet valve is difficult to conduct and even cause the nozzle to be scrapped after it is blocked by the solder paste material during the printing process

Method used

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  • A plugging device for solder paste printing nozzle
  • A plugging device for solder paste printing nozzle
  • A plugging device for solder paste printing nozzle

Examples

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Embodiment Construction

[0018] The applicant will describe in detail in the form of the following examples, but the description of the examples is not a limitation to the technical solution of the present invention, and any equivalent transformation made according to the concept of the present invention is only a formal rather than a substantive equivalent transformation All should be regarded as the scope of the technical solution of the present invention.

[0019] In the following descriptions, all concepts related to directionality or orientation of up, down, left, right, front and back are based on figure 1 The position shown is a reference, so it cannot be understood as a special limitation on the technical solution provided by the present invention.

[0020] see figure 1 and figure 2 , and combined with image 3 and Figure 4 , a nozzle blocking device for solder paste printing includes a heat insulating shell 1 , a sealing cavity mechanism 2 , a nozzle 3 , a nozzle fixing member 4 , an an...

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Abstract

A solder paste spray-printing nozzle unblocking device belongs to the technical field of fluid control in automation. The device comprises a heat insulation shell, a sealed cavity mechanism, a nozzle, a nozzle fastener, an annular heating core, and an air channel connector. The heat insulation shell is provided with an opening at the bottom, and is provided with an air inlet hole in the center of the top wall. The sealed cavity mechanism is arranged in the shell cavity of the heat insulation shell, and the upper end face of the sealed cavity mechanism and the top wall of the heat insulation shell are fixedly installed together. The center of the sealed cavity mechanism is provided with a sealed cavity which runs through the top and bottom and is communicated with the air inlet hole. The nozzle is installed below the sealed cavity mechanism through the nozzle fastener, and is communicated with the sealed cavity. The annular heating core wraps the middle of the sealed cavity mechanism in the height direction. The air channel connector is installed above the heat insulation shell, and is connected with the air inlet hole. Nozzle unblocking operation is simple, quick and efficient, no damage is caused to nozzles, and there is no wearing part. Nozzle installation and disassembly are convenient.

Description

technical field [0001] The invention belongs to the technical field of fluid control in automation, and in particular relates to a blocking device for solder paste jet printing nozzles. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT (Surface Mount Technology). It is an extremely important auxiliary material in the production of electronic products and is used for selective soldering in semiconductor packaging and PCBA (Assembled Printed Circuit Board). . The coating process of solder paste can be divided into two methods, one is screen printing, which is suitable for mass production, and the other is injection coating, that is, solder paste printing technology. The most obvious difference from the screen printing technology is that the jet printing technology is a non-stencil technology. The solder paste is ejected at high speed from the fine-hole pipe of the nozzle under the impact of the jet valve striker. In some case...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K2203/0195H05K2203/04
Inventor 王肇
Owner SUZHOU SOLDER FORCE INC