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Method of applying transfer-type fluorescent powder adhesive for coating

A fluorescent powder, transfer-type technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor adaptability

Active Publication Date: 2017-01-04
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above defects or improvement needs of the prior art, the present invention provides a coating method for dipping and transferring fluorescent powder glue. Adhesion, dipping the phosphor glue, aligning the dipping stick with the phosphor glue on the LED chip, using the adhesion of the fluid to the solid wall to coat the phosphor glue, this method can flexibly control the phosphor glue coating Cover volume and shape, overcome the problem of poor process adaptability of the existing pneumatic dispensing machine

Method used

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  • Method of applying transfer-type fluorescent powder adhesive for coating
  • Method of applying transfer-type fluorescent powder adhesive for coating
  • Method of applying transfer-type fluorescent powder adhesive for coating

Examples

Experimental program
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Embodiment 1

[0039] In this embodiment, the phosphor powder in the phosphor glue is YAG phosphor, the glue material is epoxy resin, and the concentration of the phosphor contained in the phosphor glue is 0.01 g / ml.

[0040] Dip step: Dip the dip stick into the phosphor glue and stay for 5s, then take out the pick stick, the diameter of the pick stick is 5mm; the shape of the pick stick is cylindrical or prismatic. Dip the stick into the phosphor glue to a depth H of 0mm. It is proposed that the speed U of the stick is 0.05m / s.

[0041] Coating step: Directly align the proposed dipping stick vertically with the LED chip, and ensure that the phosphor glue on the stick is in contact with the LED chip and stay for 10 seconds, then remove the stick to achieve coating. The speed U of removing the stick is 690um / s. When the fluorescent powder glue on the stick is in contact with the LED chip, the height h between the bottom end surface of the stick and the upper surface of the LED chip is 50 um...

Embodiment 2

[0044] In this embodiment, the phosphor in the phosphor glue is TAG phosphor, the glue material is liquid glass, and the concentration of the phosphor contained in the phosphor glue is 1 g / ml.

[0045] Dipping step: dip the stick into the phosphor glue and stay for 7s, then take out the stick, the diameter of the stick is 10mm; the shape of the stick is cylindrical or prismatic. Dip the stick into the phosphor glue to a depth H of 10mm. It is proposed that the speed U of the stick is 0.11m / s.

[0046] Coating step: Directly align the proposed dipping rod vertically with the LED chip, and ensure that the phosphor glue on the dipping rod is in contact with the LED chip and stay for 8 seconds, then remove the dipping rod to achieve coating. The speed U of removing the stick is 1um / s. When the fluorescent powder glue on the stick is in contact with the LED chip, the height h between the bottom end surface of the stick and the upper surface of the LED chip is 1500 um.

[0047] A...

Embodiment 3

[0049] In this embodiment, the phosphor powder in the phosphor glue is YAG phosphor, the glue material is silica gel, and the concentration of the phosphor contained in the phosphor glue is 2 g / ml.

[0050] Dip step: Dip the dipping stick into the phosphor glue and stay for 10s, then take out the dipping stick, the diameter of the dipping stick is 3mm; the shape of the dipping stick is cylindrical or prismatic. Dip the stick into the phosphor glue to a depth H of 8mm. It is proposed that the speed U of the stick is 1um / s.

[0051] Coating step: Directly align the proposed dipping rod vertically with the LED chip, and ensure that the phosphor glue on the dipping rod is in contact with the LED chip and stay for 6 seconds, then remove the dipping rod to achieve coating. The speed U of removing the stick is 0.02m / s. When the fluorescent powder glue on the stick is in contact with the LED chip, the height h between the bottom end surface of the stick and the upper surface of the ...

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Abstract

The invention discloses a method of applying a transfer-type fluorescent powder adhesive for coating, which comprises an applying step and a coating step. In the applying step, an applying rod is immersed in the fluorescent powder adhesive, and by using the adhesive attraction of the adhesive on the surface of the applying rod, the fluorescent powder adhesive is applied. In the coating step, the applying rod with the fluorescent powder adhesive is vertically aligned with an LED chip, the fluorescent powder adhesive adheres to the surface of the LED chip, and coating is completed. A pneumatic dispensing machine is not needed, free dispensing and coating of the fluorescent powder adhesive can be realized, the method is applicable to fluorescent powder adhesives of various concentrations and viscosities, changes of a dispensing quantity caused by tiny fluctuation of process parameters do not happen, and the process adaptability is strong.

Description

technical field [0001] The invention belongs to the field of LED encapsulation, and more specifically relates to a coating method for dipping and transferring fluorescent powder glue. Background technique [0002] LED (Light Emitting Diode) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. It has the advantages of high electro-optic conversion efficiency, high color rendering coefficient, long service life, environmental protection and energy saving, and small size. It is known as 21 Century green lighting source. Due to the unique advantages of LED, it has been widely used in many fields, and is considered by the industry to be the main development direction of lighting technology in the future, with huge market potential. [0003] High-power white LEDs are usually mixed with two wavelengths of blue light and yellow light or three-wavelength light of blue light, green light and red light. Due to the simple process and low...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/00
CPCH01L33/50H01L2933/0041
Inventor 罗小兵余兴建郑怀谢斌
Owner HUAZHONG UNIV OF SCI & TECH