A cob-encapsulated led module and its manufacturing process
A technology of LED module and manufacturing process, which is applied in household, office lighting and commercial fields, can solve the problems of cost reduction and light color consistency, and achieve the effects of reducing production costs, ensuring light color consistency, and good heat dissipation effect
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Embodiment 1
[0048] figure 1 Is a schematic diagram of the aluminum substrate after injection molding of the present invention; figure 2 It is a schematic diagram of the structure of the lens of the present invention opened; image 3 Is a schematic diagram of the external structure of the present invention; Figure 4 for figure 1 A cross-sectional view in the direction of A-A.
[0049] Please refer to Figure 1 to Figure 4 , A COB packaged LED module, including an aluminum substrate 100, eight LED chips 200, an optical lens group, sixteen gold wires 300, eight bonding positions (not shown in the figure) and sixteen pads 500. The shape of the aluminum substrate 100 is rectangular, and it is preferable that the optical lens group includes an optical lens 600.
[0050] Among them, eight LED chips 200 are arranged on the upper surface of the aluminum substrate 100, the optical lens 600 is arranged above the aluminum substrate 100, the optical lens 600 covers all the LED chips 200, the optical len...
Embodiment 2
[0067] The difference between the second embodiment and the first embodiment is that the fluorescent glue layer 400 is not arranged on the LED chip 200, and the phosphor particles are far away from the LED chip 200 and do not directly contact the LED chip 200. In the second embodiment, the fluorescent glue layer 400 is arranged On the optical lens 600, specifically, the fluorescent glue layer 400 is disposed on the inner surface of the optical lens 600.
[0068] Since the phosphor is excited by a blue chip with a low wavelength, the phosphor itself also has heat after excitation, plus the heat of the chip itself, forming a heat superposition. Keep the phosphor away from the LED chip, and the heat will not be superimposed. The heat dissipation effect is good, and the service life can be prolonged. At the same time, the phosphor is located on the inner surface of the lens or inside the lens body, so that the light is more uniform and the light effect is good.
[0069] The other stru...
Embodiment 3
[0087] The difference between Embodiment 3 and Embodiment 1 is that the fluorescent glue layer 400 is not arranged on the LED chip 200, and the phosphor particles are far away from the LED chip 200 and do not directly contact the LED chip 200. In the embodiment 3, the fluorescent glue layer 400 is arranged On the optical lens 600, specifically, phosphor particles are mixed in the material for making the optical lens 600 (that is, the body of the optical lens 600 is mixed with phosphor powder), and the fluorescent glue layer 400 and the optical lens 600 are set as an integrated structure, combining two For one.
[0088] The difference between the third embodiment and the second embodiment is: the second embodiment is to arrange the fluorescent glue layer 400 on the inner surface of the optical lens 600, and the third embodiment is to mix the phosphor particles in the material for making the optical lens 600 (ie The body of the optical lens 600 is mixed with phosphor powder), and t...
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