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A kind of dipping transfer type fluorescent powder adhesive coating method

A phosphor, transfer technology, used in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor adaptability

Active Publication Date: 2019-03-05
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above defects or improvement needs of the prior art, the present invention provides a coating method for dipping and transferring fluorescent powder glue. Adhesion, dipping the phosphor glue, aligning the dipping stick with the phosphor glue on the LED chip, using the adhesion of the fluid to the solid wall to coat the phosphor glue, this method can flexibly control the phosphor glue coating Cover volume and shape, overcome the problem of poor process adaptability of the existing pneumatic dispensing machine

Method used

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  • A kind of dipping transfer type fluorescent powder adhesive coating method
  • A kind of dipping transfer type fluorescent powder adhesive coating method
  • A kind of dipping transfer type fluorescent powder adhesive coating method

Examples

Experimental program
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Embodiment 1

[0039] In this embodiment, the phosphor in the phosphor glue is YAG phosphor, the glue material is epoxy resin, and the concentration of the phosphor contained in the phosphor glue is 0.01 g / ml.

[0040] Dipping step: Immerse the dipping rod in the phosphor glue and stay for 5s, then lift out the dipping rod, the diameter of the dipping rod is 5mm; the shape of the dipping rod is cylindrical or prismatic. The depth H of the dip stick immersed in the phosphor glue is 0mm. It is proposed that the speed U of the dip stick is 0.05m / s.

[0041] Coating step: directly align the proposed dip stick vertically to the LED chip, and ensure that the phosphor glue on the dip stick is in contact with the LED chip and stay for 10s, remove the dip stick to realize coating. The speed U of removing the dip stick is 690um / s. When the phosphor glue on the dip stick is in contact with the LED chip, the distance h between the bottom end face of the dip stick and the top surface of the LED chip is...

Embodiment 2

[0044] In this embodiment, the phosphor in the phosphor glue is TAG phosphor, the glue material is liquid glass, and the concentration of the phosphor contained in the phosphor glue is 1 g / ml.

[0045] Dipping step: Immerse the dipping rod in the phosphor glue and stay for 7s, then lift the dipping rod, the diameter of the dipping rod is 10mm; the shape of the dipping rod is cylindrical or prismatic. The dip stick is dipped into the phosphor glue with a depth H of 10mm. It is proposed that the speed U of the dip stick is 0.11m / s.

[0046] Coating step: directly align the proposed dip stick vertically to the LED chip, and ensure that the phosphor glue on the dip stick is in contact with the LED chip and stay for 8s, then remove the dip stick to realize coating. The speed U of removing the stick is 1um / s. When the phosphor glue on the dip stick is in contact with the LED chip, the distance h between the bottom end face of the dip stick and the top surface of the LED chip is 15...

Embodiment 3

[0049] In this embodiment, the phosphor in the phosphor glue is YAG phosphor, the glue material is silica gel, and the concentration of the phosphor contained in the phosphor glue is 2 g / ml.

[0050] Dipping step: Immerse the dipping rod in the phosphor glue and stay for 10s, then lift out the dipping rod, the diameter of the dipping rod is 3mm; the shape of the dipping rod is cylindrical or prismatic. The dip stick is immersed in the phosphor glue with a depth H of 8mm. It is proposed that the speed U of the dip stick is 1um / s.

[0051] Coating step: directly align the proposed dip stick vertically to the LED chip, and ensure that the phosphor glue on the dip stick is in contact with the LED chip and stay for 6s, then remove the dip stick to realize coating. The speed U of removing the dip stick is all 0.02m / s. When the phosphor glue on the dip stick is in contact with the LED chip, the distance h between the bottom end face of the dip stick and the top surface of the LED c...

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Abstract

The invention discloses a method of applying a transfer-type fluorescent powder adhesive for coating, which comprises an applying step and a coating step. In the applying step, an applying rod is immersed in the fluorescent powder adhesive, and by using the adhesive attraction of the adhesive on the surface of the applying rod, the fluorescent powder adhesive is applied. In the coating step, the applying rod with the fluorescent powder adhesive is vertically aligned with an LED chip, the fluorescent powder adhesive adheres to the surface of the LED chip, and coating is completed. A pneumatic dispensing machine is not needed, free dispensing and coating of the fluorescent powder adhesive can be realized, the method is applicable to fluorescent powder adhesives of various concentrations and viscosities, changes of a dispensing quantity caused by tiny fluctuation of process parameters do not happen, and the process adaptability is strong.

Description

technical field [0001] The invention belongs to the field of LED packaging, and more particularly relates to a dip-and-transfer fluorescent powder glue coating method. Background technique [0002] LED (Light Emitting Diode) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. It has the advantages of high electro-optical conversion efficiency, high color rendering coefficient, long service life, environmental protection and energy saving, and small size. It is known as 21 Century green lighting source. Due to the unique advantages of LED, it has been widely used in many fields, and is considered by the industry as the main development direction of future lighting technology, with huge market potential. [0003] High-power white LEDs are usually composed of two wavelengths of blue light and yellow light, or blue light, green light, and three wavelengths of red light. Due to the simple process and low cost of obtaining a white...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/00
CPCH01L33/50H01L2933/0041
Inventor 罗小兵余兴建郑怀谢斌
Owner HUAZHONG UNIV OF SCI & TECH