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High-temperature and high-humidity LED packaging isolation polymer and LED device

A technology of LED packaging and LED devices, which is used in semiconductor devices, electrical components, circuits, etc.

Pending Publication Date: 2021-04-23
清远慧谷新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the present invention provides a high-temperature and high-humidity LED packaging isolation polymer and LED device, which solves the problem of light color consistency while ensuring the high barrier property of the LED device in a high-temperature and high-humidity environment. The problem

Method used

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  • High-temperature and high-humidity LED packaging isolation polymer and LED device
  • High-temperature and high-humidity LED packaging isolation polymer and LED device

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Such as figure 1 As shown, this embodiment provides an LED device, including a bracket 1, the bracket 1 is provided with an inverted trapezoidal groove 4, the surface of the groove 4 is provided with a silver-plated layer, the bottom of the groove 4 is provided with a bipolar chip, and the groove 4 is provided with a bipolar chip. 4 is filled with an isolation layer 5 covering the bipolar chip, and the encapsulation adhesive layer 3 is organic silica gel mixed with yellow fluorescent powder. Isolation layer 5 is polymer, and its molecular formula is (Me 3 SiO 1 / 2 ) a (HSiO 3 / 2 ) b (Me 2 SiO 2 / 2 ) c (SiO 2 ) d , wherein Me is methyl, a:b:c:d=5:15:15:85. The isolation layer 5 is coated on the upper surface of the encapsulation adhesive layer 3 by spraying. The isolation layer 5 is used to block the contact between the light reflection layer and the outside air. The thickness of the isolation layer 5 is 100 nm.

[0027] The synthesis method of the polymer is as ...

Embodiment 2

[0029] Such as figure 1 As shown, this embodiment provides an LED device, including a bracket 1, the bracket 1 is provided with an inverted trapezoidal groove 4, the surface of the groove 4 is provided with a silver-plated layer, the bottom of the groove 4 is provided with a bipolar chip, and the groove 4 is provided with a bipolar chip. 4 is filled with an isolation layer 5 covering the bipolar chip, and the encapsulation adhesive layer 3 is organic silica gel mixed with yellow fluorescent powder. Isolation layer 5 is polymer, and its molecular formula is (Me 3 SiO 1 / 2 ) a (NH 2 SiO 3 / 2 ) b (Me 2 SiO 2 / 2 ) c (SiO 2 ) d , wherein Me is methyl, a:b:c:d=6:15:17:46. The isolation layer 5 is coated on the upper surface of the encapsulation adhesive layer 3 by spraying. The isolation layer 5 is used to block the contact between the light reflection layer and the outside air. The thickness of the isolation layer 5 is 500 nm.

[0030] The synthesis method of the polymer i...

Embodiment 3

[0032] Such as figure 1As shown, this embodiment provides an LED device, including a bracket 1, the bracket 1 is provided with an inverted trapezoidal groove 4, the surface of the groove 4 is provided with a silver-plated layer, the bottom of the groove 4 is provided with a bipolar chip, and the groove 4 is provided with a bipolar chip. 4 is filled with an isolation layer 5 covering the bipolar chip, and the encapsulation adhesive layer 3 is organic silica gel mixed with yellow fluorescent powder. Isolation layer 5 is polymer, and its molecular formula is (Me 3 SiO 1 / 2 ) a (HSiO 3 / 2 ) b (Ph 2 SiO 2 / 2 ) c (SiO 2 ) d , wherein Me is methyl, Ph is phenyl, a:b:c:d=0.5:1:0.5:98. The isolation layer 5 is coated on the upper surface of the encapsulation adhesive layer 3 by spraying. The isolation layer 5 is used to block the contact between the light reflection layer and the outside air. The thickness of the isolation layer 5 is 10 nm.

[0033] The synthesis method of the ...

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Abstract

The invention discloses a high-temperature and high-humidity LED packaging isolation polymer and an LED device. The polymer has the following molecular structural general formula: (R3SiO1 / 2)a(RSiO3 / 2)b (R2SiO2 / 2)c(MfNg)d(XO1 / 2)e, and the optimal matching property of a packaging adhesive layer and a bracket is realized by optimizing the types and the proportioning dosages of organic active groups of an obtained isolation layer polymer, so that the LED device has the optimal barrier property, the optimal luminous flux maintenance rate after vulcanization and the light color consistency.

Description

technical field [0001] The invention belongs to the technical field of LED lighting, backlight and display, and in particular relates to the improvement of LED filament packaging technology. Background technique [0002] The basic structure of the LED is an electroluminescent semiconductor material chip, which is fixed to the bracket with a solid crystal glue, and then connected to the chip and the circuit board with a silver wire or a gold wire, and then sealed with epoxy resin or silica gel around it to protect the inside. The role of the structure, and finally the housing is installed. At present, the functional area at the bottom of the LED bracket is basically a silver-plated layer. Since sulfide, water, etc. can easily pass through the encapsulation layer and react with the silver-plated layer in the functional area, a black silver compound is produced, which causes the LED device to appear light. decline phenomenon. [0003] In addition, as a light-emitting device, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/12C08G77/26C08G77/06H01L33/56
CPCC08G77/12C08G77/26C08G77/06H01L33/56
Inventor 陈旺王铃玉郑海庭黄光燕
Owner 清远慧谷新材料技术有限公司