Mounting head converging structure and intelligent chip mounter

Abstract

The invention discloses a mounting head converging structure and an intelligent chip mounter and belongs to the technical field of chip mounters. The mounting head converging structure comprises a converging plate body, a vacuum electromagnetic valve, an air-pressure electromagnetic valve and an air-pressure sensor, wherein the converging plate body is provided with a positive pressure channel, a negative pressure channel, an executing channel, a pressure measuring channel and a connecting channel, and the pressure measuring channel is communicated with the executing channel; the vacuum electromagnetic valve is provided with a first vacuum channel communicated with negative pressure channel, a second vacuum channel communicated with the executing channel and a third vacuum channel communicated with the connecting channel; the air-pressure electromagnetic valve is provided with a first air-pressure channel communicated with the positive pressure channel, a second air-pressure channel communicated with the connecting channel and a third air-pressure channel communicated with the outside; the measuring end of the air-pressure sensor is inserted into the pressure measuring channel. The mounting head converging structure allows a mounting head to be small in size, lightweight and relatively low in cost.

Description

technical field [0001] The invention relates to the technical field of placement machines, in particular to a mounting head confluence structure and an intelligent placement machine. Background technique [0002] The placement machine, also known as "mounting machine" and "surface mount system", is an equipment used to realize high-speed, high-precision and fully automatic placement of components. It is also the most critical and complex equipment in the entire SMT production. The surface mount components are accurately placed on the corresponding pads of the PCB by moving the placement head. The placement head of the placement machine is equipped with a suction nozzle assembly that uses vacuum suction to pick and place components. When the component needs to be picked up, the suction nozzle on the placement head is in a vacuum adsorption state, and when the component needs to be placed on the PCB When it is on, it is necessary to provide positive air pressure to the suctio...

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Problems solved by technology

[0003] In the prior art, the positive and negative pressure control of the airflow generally adopts two airflow manifolds arranged on the placement head, namely, the positive pressure airflow manifold and the negative pressure airflow manifold. The positive pressure value of the airflow is determined by the positive pressure The positive pressure sensor on the airflow manifold is measured, and the negative pressure value of the airflow is measured by the negative pressure sensor installed on the negative pressure airflow manifold. Due to the large number of components used in this structure, the placement head The volume is large, the quality is large, and the cost of the equipment is relatively high

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