Unlock instant, AI-driven research and patent intelligence for your innovation.

Combined miniature thermal shock test device shell

A technology of cold and heat shock and test device, which is used in measuring devices, instruments, scientific instruments, etc.

Inactive Publication Date: 2017-01-11
成都尚智恒达科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a combined miniature thermal shock test device housing to solve the difficulties in the design of the external housing of the miniature thermal shock test device in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Combined miniature thermal shock test device shell
  • Combined miniature thermal shock test device shell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as Figure 1-Figure 2 As shown, a combined miniature thermal shock test device shell is equipped with a semiconductor refrigeration device 8, including an outer shell 1, and two independent inner shells 2 are arranged in the outer shell 1, and the inner shell 2 Inside, a limiting plate 5, a movable sealing plate 4, and a sealing ring plate 6 are sequentially provided from top to bottom, and installation gaps 21 are provided above the upper limiting plate 5 on the opposite surfaces of the two inner shells 2, and the semiconductor refrigeration device 8 The cold end surface and the hot end surface of the two inner casings 2 are respectively installed at the installation gaps 21, and the gaps between the outer casing 1 and the inner casing 2 and between the two inner casings 2 and the semiconductor refrigeration device 8 are filled with Insulation layer 3.

[0022] In this embodiment, since the outer shell 1 is provided with two independent inner shells 2, and the ga...

Embodiment 2

[0024] Further optimization is made on the basis of the shell of a combined miniature thermal shock test device described in Example 1. The upper end of the outer shell 1 is provided with lugs 11 to facilitate the hanging of the outer shell 1 on the bracket.

Embodiment 3

[0026] On the basis of the housing of a combined miniature cold and thermal shock test device described in Example 1, further optimization is carried out, and both sides of the sealing ring plate 6 are provided with sealing rings; the setting of this embodiment makes the base It is sealed with the sealing ring plate 6 to ensure the sealing of the cold test room and the hot test room, there is no heat exchange between the outside world and the cold test room and the hot test room, and the energy consumption of the test device is low; when replacing the electronic components to be tested, the movable sealing plate 4 and the seal ring plate 6 are sealed, which reduces the heat exchange between the outside world and the cold and hot test chambers during the replacement process, ensuring low temperature fluctuations.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a combined miniature thermal shock test device shell, relating to the field of electronics testing. A semiconductor refrigeration device is installed on the shell. The shell comprises an outer shell, wherein two independent inner shells are arranged in the outer shell; a stop plate, an active seal plate and a sealing ring plate are arranged in each inner shell from top to bottom in sequence; installing gaps are formed above the stop plates on the opposite sides of the two inner shells; the cold end face and hot end face of the semiconductor refrigeration device are respectively installed in the installing gaps of the two inner shells; insulating layers fill the gaps between the outer shell and the inner shells as well as the two inner shells and the semiconductor refrigeration device. The shell has the beneficial effects that the difficulties in design of the outer shells of miniature thermal shock test devices in the prior art are resolved by adopting the bilayer structure, filling the insulating layers and respectively installing the cold end face and hot end face of the semiconductor refrigeration device in the installing gaps of the two inner shells.

Description

technical field [0001] The invention relates to the field of electronic product testing, in particular to a shell of a combined miniature thermal shock test device. Background technique [0002] The hot and cold test chamber, also known as the "hot and cold shock test chamber", is a testing device that can instantly switch from high temperature to low temperature. It is used to test material structures or composite materials. To the extent that it can endure, the chemical changes or physical damage caused by thermal expansion and contraction of the sample can be detected in the shortest time. [0003] The existing cold and hot test chambers are bulky, require a large floor space, and are inconvenient to move; the price is expensive, costing tens of thousands of yuan, which is difficult for ordinary small enterprises to bear; a large amount of refrigerant is required during the test, which pollutes the environment Large; when testing microelectronic components, due to the la...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/60G01N3/02
CPCG01N3/60G01N3/02
Inventor 任无史晓莉
Owner 成都尚智恒达科技有限公司