Mask scratch prevention system and exposure system
A mask and substrate technology, which is used in microlithography exposure equipment, photolithographic process exposure devices, optics, etc., to reduce repair costs and prevent foreign objects from being scratched.
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Embodiment 1
[0042] see figure 1 , figure 2 , Figure 7 and Figure 8 The anti-mask scratching system provided by the embodiment of the present invention includes: a scanning unit 1 and a detection unit 2 connected to the output end of the scanning unit 1;
[0043] The scanning unit 1 is used to scan the height of the foreign matter on the surface of the substrate in the exposure state;
[0044] The detection unit 2 is used to judge whether there is a foreign object with a height greater than a preset height on the surface of the substrate in the exposure state, if yes, stop exposing the substrate, if not, continue exposing the substrate; The height difference from the height to the height of the substrate 03.
[0045] Combine below Figure 7 and Figure 8 The working process of the anti-mask scratching system provided in this embodiment will be described in detail.
[0046] In the first step, the scanning unit 1 scans the height of the foreign matter on the surface of the substrat...
Embodiment 2
[0099] Please refer to Figure 1-Figure 2 An embodiment of the present invention also provides an exposure system, including the anti-mask scratch system provided in Embodiment 1, the anti-mask scratch system is arranged in a non-exposed area of the base 01 of the exposure system.
[0100] Compared with the prior art, the exposure system provided by the embodiment of the present invention has the same beneficial effects as the mask scratch prevention system provided by the first embodiment above, and details are not repeated here.
[0101] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.
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