A kind of white light led packaging device and preparation method thereof

Abstract

The invention discloses a white LED (light emitting diode) packaging device. The white LED packaging device comprises a blue LED chip, a light conversion layer, a copper sheet and a reflective sheet, wherein the reflective sheet is thermally cured and overlapped on the copper sheet under the initial B-stage state; the reflective sheet is made of a white reflective material, and is in a bowl cup shape; the blue LED chip is arranged at the cup bottom part of the reflective sheet, and the light conversion layer is coated on the blue LED chip. The invention also correspondingly discloses a preparation method of the white LED packaging device. The white LED packaging device has the advantages that the packaging light emitting efficiency is high, the vulcanizing-preventing effect is better, and the mechanical strength is high. The preparation method has the advantages that compared with the traditional technology, the number of preparation technology steps is fewer, the processing is simple, the implementing is easy, and the preparation cost is favorably reduced on the basis of improving product quality.

Description

technical field [0001] The invention belongs to the technical field of light emitting diodes (LEDs), and in particular relates to a white light LED packaging device and a preparation method thereof. Background technique [0002] Light-emitting diodes (LEDs) have gradually entered the mainstream lighting market due to their high luminous efficiency, long life, and non-toxic green, and have been increasingly used in tunnel lighting, landscape lighting, greenhouse lighting, and indoor lighting. [0003] Today, the mainstream of LED packaging market is to use PLCC bracket package. The package structure includes copper sheet and plastic. Among them, the plastic is processed into a bowl-shaped bracket, and the bottom of the bowl is usually treated with silver to enhance reflection and improve packaging. efficiency. However, the PLCC bracket package has the following defects: [0004] (1) Low mechanical strength; [0005] (2) External pollutants are easy to penetrate into the ga...

AI Technical Summary

Problems solved by technology

[0004] (1) Low mechanical strength;

[0005] (2) External pollutants are easy to penetrate into the gap between the organic silica gel in the bowl and the bottom, which can easily cause silver plating corrosion;

[0006] (3) The silver-plated layer also needs to take anti-sulfur into account, and there are many problems. For example, if the silver-plated layer adopts an anti-sulfur protective layer, the anti-sulfur effect is better, but the cost is high and the spot coating process is difficult; if high hardness is used Silica gel, the anti-sulfur effect is average, and it is easy to cause the gold wire to break; if the silver-plated layer is made of white silica gel, the anti-sulfur effect is better, but the processing technology is difficult

[0009] (2) The Chinese patent application number 201410020728 discloses a LED packaging process that uses low-reflective black EMC plastic packaging materials to achieve high reflective effects, that is, a layer of reflective material is directly added to the surface of the black EMC bracket material. This packaging process can make Black EMC material can achieve high light extraction efficiency, but obviously, its manufacturing process is also relatively difficult;

[0010] (3) The Chinese patent application number 201310339703.2 discloses a packaging process for light-emitting diodes. The bottom plate of the bracket is coated with a reflective coating and used as a crystal-bonding glue. Although this patent can improve the anti-vulcanization effect and light extraction efficiency, its The manufacturing process is still very difficult, and the packaging efficiency is not high;

[0011] (4) The Chinese patent application number 201020700819.6 discloses a vulcanization-proof patch LED, which adds an anti-vulcanization layer on the surface of the fluorescent glue, thereby effectively improving the anti-vulcanization effect of the product, but reducing the light extraction efficiency;

[0012] (5) The U.S. patent with the application number US 2013 / 0285082 discloses that a reflective cup is made around the flip-chip LED chip to achieve higher light extraction efficiency and lower manufacturing cost, but the reflective cup described in it is made of plastic , and there is no substrate, there are many problems such as low mechanical strength and poor anti-sulfurization effect;

[0013] (6) The U.S. patent application number US 2013 / 0029439 discloses a method for preparing a flip-chip LED chip. First, the light-emitting chip is placed on a temporary carrier, and baffles are set around it. Fluorescent glue is applied and then scraped. Flat, and cut into single pieces, the preparation process described in this patent has many problems such as the bottom pad electrode is easily polluted

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