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Encapsulation structure, shielding member and its manufacturing method

A packaging structure and shielding technology, which is applied in the fields of magnetic field/electric field shielding, electrical components, semiconductor devices, etc., can solve the problems of high cost, poor shielding effect of metal film 12, long process time of metal film 12, etc., so as to avoid the occurrence of wrong effect

Active Publication Date: 2020-11-03
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the existing radio frequency module 1, the metal thin film 12 has a long process time and extremely high cost
[0006] In addition, the metal film 12 is formed on the outside of the packaging material 13 to prevent EMI, that is, the metal film 12 is separated from the interference source (ie, the electronic component 11) by the packaging material 13, so when the electronic component 11 When it is a low-frequency component, even if the metal film 12 covers the top and side of the packaging material 13, the shielding effect of the metal film 12 is still not good, causing the signal error of the low-frequency electronic component 11 to easily occur

Method used

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  • Encapsulation structure, shielding member and its manufacturing method
  • Encapsulation structure, shielding member and its manufacturing method
  • Encapsulation structure, shielding member and its manufacturing method

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Embodiment Construction

[0049] The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0050] It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to match the content disclosed in the specification for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention. condition, so it has no technical substantive meaning, and any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of the present invention without affecting the effect and purpose of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "upper", "lower", "first", "s...

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Abstract

An encapsulating structure, a shield and a manufacturing method of the shield. The encapsulating structure includes an electronic element, the shield bonding to the electronic element and an encapsulating material covering the electronic element and the shield, wherein the shield includes a magnetic metal oxide layer and a protective layer disposed on the magnetic metal oxide layer. Through a design that the shield is directly bonded to the electronic element, the shield can effectively shield the electronic element so as to avoid signal errors of the electronic element.

Description

technical field [0001] The invention relates to a package structure, especially a package structure with a shield, the shield and its manufacturing method. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to improve the electrical quality, a variety of semiconductor products have shielding functions to prevent electromagnetic interference (ElectromagneticInterference, Abbreviated as EMI) generated. [0003] The current electronic products are developing toward the goal of miniaturization and high speed, especially the development of the communication industry has been widely used and integrated in various electronic products, such as cell phones, laptops and so on. The above-ment...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/28H01L23/58H05K9/00
CPCH01L2224/48091H01L2224/73253H01L2224/73257H01L2924/181H01L2924/00014H01L2924/00012
Inventor 许聪贤钟兴隆朱德芳
Owner SILICONWARE PRECISION IND CO LTD