Package method of diode pumping laser module

A diode module, pump laser technology, applied in lasers, laser parts, semiconductor lasers, etc., can solve the problems of unguaranteed distribution uniformity, inconvenient operation, low packaging efficiency, etc., achieve simple and efficient packaging steps, and improve distribution. uniformity, the effect of improving pump performance

Active Publication Date: 2017-02-01
INST OF APPLIED ELECTRONICS CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] (1) The heat sink and ceramic sheet in the diode module are not firmly fixed, and the solder filling is difficult;
[0004] (2) The solder cannot be separated from the cooler after welding;
[0005] (3) Without protective measures for the diode module, the diode module is easily damaged;
[0006] (4) Inconvenient operation and low packaging efficiency;
[0007] (5) The force on each diode module on the cooler is not uniform, so that the uniformity of distribution cannot be guaranteed;
[0008] (6) It is not possible to manually package the pump modules with smaller specifications

Method used

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  • Package method of diode pumping laser module
  • Package method of diode pumping laser module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] 1a. Install the cooler 2 on the upper surface of the installation base 1;

[0057] 1b. Bind the device entity 4 into a regular pentagon with O-ring 5, N=5;

[0058]1c. Install the upper pressing block 7 and the lower pressing block 3 in the inner cavity of the device entity 4, and then tighten the long screws 8 to fix the device entity 4, the upper pressing block 7 and the lower pressing block 3 into a device module;

[0059] 1d. Insert the device module vertically into the cooler 2 and the installation base 1. The cylinder at the lower end of the lower pressure block 3 is fitted and positioned with the positioning hole at the bottom of the installation base 1. The gap L1 and gap L2 meet L1-L2= 2mm;

[0060] 1e. Place five diode modules 9 on the upper surfaces of the corresponding regular pentagonal bosses;

[0061] 1f. Continue to tighten the long screw 8, the upper pressing block 7 and the lower pressing block 3 are close to each other, and the five identical triang...

Embodiment 2

[0066] Embodiment 2 is basically the same as Embodiment 1, the main difference is that N=7, L1-L2=2.5mm, and a heptagonal diode-pumped laser module is obtained.

Embodiment 3

[0068] Embodiment 3 is basically the same as Embodiment 1, the main difference is that N=9, L1-L2=3mm, and a nonagonal diode-pumped laser module is obtained.

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Abstract

The invention provides a package method of a diode pumping laser module. According to the package method, N triangular prisms are combined to form a regular N-polygonal device entity, the device entity is uniformly extended outwards by tightening an upper press block and a lower press block which are vertically symmetric and are in conical shapes, corresponding N diode modules outside the device entity are tightened, welding fluxes are added to adjacent positions of the N diode modules and are molten in a high-temperature furnace, and the device module is disassembled after normal-temperature cooling to obtain the diode pumping laser module. By the package method of the diode pumping laser module, the distribution uniformity of the diode modules on a cooler is improved, the pumping performance of a crystal rod is improved, the package step is simple and high-efficiency, the safety of the diode modules is improved, and the package of the diode pumping laser module in relatively small specification is achieved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lasers, and in particular relates to a method for packaging a diode-pumped laser module. Background technique [0002] The ring pump module is an essential part of a diode pumped solid-state laser system. In ring-pumped modules, the uniformity of the distribution of diode modules around the circumference of the crystal rod (laser gain medium) is directly related to its pumping performance. The crystal rod and the cooler can be machined to ensure coaxiality, so the uniformity of the diode module package on the inner section of the cooler directly affects the pumping performance of the module. In the early stage, the diode module was completely packaged by hand, and there were mainly the following problems: [0003] (1) The heat sink and ceramic sheet in the diode module are not firmly fixed, and the solder filling is difficult; [0004] (2) The solder cannot be separated from the cooler af...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022
CPCH01S5/02365
Inventor 唐淳尹新启高松信雒仲祥魏彬廖原石勇卢飞邹凯
Owner INST OF APPLIED ELECTRONICS CHINA ACAD OF ENG PHYSICS
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