Manufacturing method of a sensor
A manufacturing method and sensor technology, which are used in the manufacture of microstructure devices, piezoelectric devices/electrostrictive devices, processes for producing decorative surface effects, etc. Avoid occlusion, save the circuit board, and ensure the effect of thinning
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no. 1 example
[0028] see figure 2 , a double-sided image sensor 2 comprising:
[0029] A first substrate 21a, which may be a silicon substrate, on which electronic components (light receiving regions) are formed, the first substrate 21a includes a front surface having a first light receiving region 22a and a rear surface opposite to the front surface ;
[0030] The groove 25 on the back side of the first substrate 21a, the depth of the groove 25 is less than or equal to half the thickness of the first substrate, and the bottom of the groove 25 should be far away from the first light receiving area 22a;
[0031] The second substrate 21b fixed on the bottom of the groove 25, the second substrate 21b includes a front with a second light receiving area 22b and a back opposite to the front, the front of the second substrate 21b coplanar with the back surface of the first substrate 21a.
[0032] On the front side of the first substrate 21a, there is a first optical filter 24a bonded by a fir...
no. 2 example
[0050] see image 3 , a double-sided image sensor 3 comprising:
[0051] A first substrate 21a, which may be a silicon substrate, on which electronic components (light receiving regions) are formed, the first substrate 21a includes a front surface having a first light receiving region 22a and a rear surface opposite to the front surface ;
[0052] The groove 25 on the back side of the first substrate 21a, the depth of the groove 25 is less than or equal to half the thickness of the first substrate, and the bottom of the groove 25 should be far away from the first light receiving area 22a;
[0053] The second substrate 21b fixed on the bottom of the groove 25, the second substrate 21b includes a front with a second light receiving area 22b and a back opposite to the front, the front of the second substrate 21b coplanar with the back surface of the first substrate 21a.
[0054] On the front side of the first substrate 21a, there is a first optical filter 24a bonded by a first ...
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