Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Case, cooling method and structure of case and cabinet formed by cooling structure of case

A heat dissipation structure and chassis technology, which is applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of impossibility, many external lines, and dust ingress, so as to prevent dust from entering and reduce external lines , Good dustproof effect

Inactive Publication Date: 2017-02-22
梁丽君 +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing chassis is large in size and heavy in weight, and the external circuits are many and chaotic. Dust is easy to enter the chassis and pollute the electronic components inside.
For the requirement of making ultra-thin chassis, the existing chassis cannot be realized, especially the problem of heat dissipation, which has become a technical problem for people to develop ultra-thin chassis

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Case, cooling method and structure of case and cabinet formed by cooling structure of case
  • Case, cooling method and structure of case and cabinet formed by cooling structure of case

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: The support is an aluminum alloy radiator. The aluminum alloy radiator is provided with vertical cooling fins 9 . Each cooling fin constitutes a vertical cooling channel, which is air-cooled and dissipated by a cooling fan. The support is also provided with heat dissipation pipes for accommodating liquid, through which heat exchange is performed, and the flow of liquid is driven by a hydraulic pump.

Embodiment 2

[0032] Embodiment 2: A heat dissipation pipe 31 for holding liquid is provided on the support, and heat exchange is performed through the liquid, and the flow of the liquid is driven by a hydraulic pump.

[0033] The present invention implements a fully enclosed structure between the support and the side panels on both sides of the chassis body to prevent dust from entering. Wherein the support consists of a support body, the top 2 and the bottom of the support body, the top and / or bottom of the support body extend to form the surface of the chassis body, the side panels on both sides of the chassis body are fixed by supports, or the top and bottom of the support body The top panel 21 and the bottom panel of the chassis body are fixed respectively, and the side panels 1 on both sides of the chassis body are fixed by the top panel and the bottom panel. A fully enclosed structure is implemented between them to prevent dust from entering.

[0034] To make an ultra-thin chassis, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a case. The case comprises a case body, wherein the case body is internally provided with a support; a spacing distance is arranged between the support and each of side panels on two sides of the case body; a line groove or line cavity and a circuit socket are formed in the support; the support is used for fixing a computer mainboard; and the support forms a heat exchanger which is used for collecting heat and externally carrying out heat exchange. The invention furthermore discloses a cooling structure of the case, a cooling method of the thin-walled case and a cabinet formed according to the cooling structure of the case. The case disclosed by the invention is small in volume and few in external circuits so that benefit is brought to the manufacture of an ultra-thin case and benefit is brought to the cooling.

Description

technical field [0001] The invention relates to the technical field of computer equipment, in particular to a chassis technology. Background technique [0002] Existing computer cases generally include a left side panel, a right side panel, a top side panel, a bottom side panel, a front side panel and a rear side panel and a three-dimensional cavity formed by a skeleton, and the computer mainboard is fixed on the left side or the right side. On the side panel side, the computer motherboard and other sides of the computer case form a large case space. In this large case space, the hard disk and optical drive are installed by setting compartments. The side board and the right side board are arranged vertically. Generally, fans are installed on the rear side panel, and some fans are installed on the left or right side panel for air cooling and heat dissipation. Some computers use water for cooling, and heat dissipation pipes are also arranged in this large chassis space. The ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/20G06F1/183G06F1/184G06F2200/201
Inventor 梁丽君曾华琛
Owner 梁丽君
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com