Semiconductor radiator device and package structure using the radiator

Abstract

The invention discloses a semiconductor radiating fin device and a packaging structure using the radiating fin. The semiconductor radiating fin device is suitable for being arranged on a semiconductor substrate equipped with a plurality of positioning elements, and comprises a plurality of radiating fins and a positioning frame. Each radiating fin is roughly quadrilateral, and the radiating fins are arranged into an array. Each radiating fin includes a body and a cutting path surrounding the periphery of the body. Each cutting path has a plurality of first through holes, and the first through holes are arranged at the four corners of the body of the corresponding radiating fin. The positioning frame surrounds the radiating fins and the cutting paths, and includes a plurality of positioning holes corresponding to the positioning elements.

Description

technical field [0001] The invention relates to a semiconductor heat sink device and a package structure using the heat sink, in particular to a heat sink device and package structure arranged on a semiconductor substrate with a plurality of positioning parts. Background technique [0002] With the continuous improvement of semiconductor manufacturing process, semiconductor chips are widely used in electronic products such as notebook computers, tablet computers, digital cameras, and smart phones. The heat generated and the relative heat flux are getting higher and higher. On the other hand, the appearance of electronic devices is also trending toward light, thin, short, and small designs. Such an extremely compressed space design direction makes the heat dissipation of the semiconductor even more obvious. importance. [0003] Because the high heat generated by the semiconductor chip during operation will directly affect the command cycle of the semiconductor chip, the indu...

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Problems solved by technology

[0004] In addition, as the volume of electronic products becomes smaller and smaller, the volume of the semiconductor chip and the heat sink made of the metal also needs to be smaller and smaller. Due to the difficulty of soldering or fitting operations, the gap between the semiconductor chip and the heat sink is getting smaller and smaller. A little carelessness will cause the metal heat sink and the semiconductor chip to be improperly formed. Contact and short circuit, or external electrostatic interference, cause the semiconductor chip to fail, and reduce the packaging yield of the semiconductor chip

[0005] Furthermore, since the general heat sink manufacturing process usually undergoes continuous stamping and forming, and then cuts into individual heat sinks, and in the cutting process, due to the ductility of metal heat sinks, There will be burrs during the process, and the burrs are generated in accordance with the cutting direction. If the burrs are not trimmed, the heat sink will not meet the factory specifications and lead to return. The burrs on the periphery will be removed, which will make the processing process more complicated and increase the production cost

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