A method of manufacturing a cooler

A manufacturing method and cooler technology, which are used in semiconductor devices, electric solid-state devices, semiconductor/solid-state device parts, etc., can solve the problem of insufficient cleaning and drying of nickel-plated layer pollution, poor moisture in solder, poor soldering, etc. problems, to achieve the effect of increasing the lamination tightness, preventing relative stress, and improving heat dissipation efficiency

CN106449566BActive Publication Date: 2018-12-28YATAI XINGYUAN FARMING TECH HAIAN CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2018-12-28

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Abstract

The invention provides a manufacturing method of a cooler. The manufacturing method comprises the following steps: (1) providing a Ni layer and a Cu layer, wherein the Ni layer and the Cu layer have the same length and width; (2) depositing one layer of Ci layer on the Cu layer to form a Ti-layer on Cu-layer structure; or additionally providing one Ti layer to form the Ti-layer on Cu-layer structure in a manner of laminating and bonding; (3) etching a plurality of through holes in the Ti layer until a plurality of through holes penetrating through the Cu layer are formed, so as to form a through hole array; (4) filling a Cu-layer material into the through holes which are uniformly spaced to form Cu-layer material through holes; (5) filling a Ni-layer material into other through holes, which are uniformly spaced and are not filled, to form Ni-layer material through holes; and (5) overlapping the Ni layer on the Ti layer and carrying out high-temperature laminating and bonding to realize metal alloying.
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Description

technical field

[0001] The present invention relates to coolers, and more particularly to a method of manufacturing coolers having stacked laminated metal materials. Background technique

[0002] In a semiconductor module such as a power semiconductor module, a semiconductor element is mounted on an insulating substrate. And, in order to reduce the temperature of the semiconductor element that rises with the operation of the semiconductor element, the insulating substrate is arranged on the cooling surface of the cooler (including a heat sink, heat sink, heat sink, etc.) and is in contact with the cooling surface. combine.

[0003] The insulating substrate has a ceramic layer as an electrical insulating layer, a wiring layer (circuit layer), and the like. The wiring layer is formed of copper, aluminum, or the like.

[0004] Coolers made of copper or aluminum (including their alloys) are used as coolers, but the solder jointability of coolers made of aluminum or copper is ...

Examples

Embodiment Construction

[0034] The "layer" mentioned in the present invention can be substrates such as boards and sheets. Lamination refers to thermocompression bonding or bonding. Alloying refers to the use of diffusion to form a diffusion alloy layer on the contact surface of two metals.

[0035] see figure 1 , the present invention provides a cooler, comprising: a laminated material that has a Ni layer 3, a Ti layer 2 and a Cu layer 1 sequentially bonded and integrated into a laminated shape, and the Ni layer 3 has a function for making the object to be cooled The upper surface joined by soldering is made of Ni or a Ni alloy, the Ti layer 2 is arranged on the lower surface side of the Ni layer 3 and is made of Ti or a Ti alloy, and the Cu layer 1 is arranged on the The lower surface side of the Ti layer 2 is composed of Cu or Cu alloy, and the cooler makes the lower surface of the Cu layer 1 of the laminated material and the cooling surface of the cooler main body bonded via a brazing material la...