A method of manufacturing a cooler

Abstract

The invention provides a manufacturing method of a cooler. The manufacturing method comprises the following steps: (1) providing a Ni layer and a Cu layer, wherein the Ni layer and the Cu layer have the same length and width; (2) depositing one layer of Ci layer on the Cu layer to form a Ti-layer on Cu-layer structure; or additionally providing one Ti layer to form the Ti-layer on Cu-layer structure in a manner of laminating and bonding; (3) etching a plurality of through holes in the Ti layer until a plurality of through holes penetrating through the Cu layer are formed, so as to form a through hole array; (4) filling a Cu-layer material into the through holes which are uniformly spaced to form Cu-layer material through holes; (5) filling a Ni-layer material into other through holes, which are uniformly spaced and are not filled, to form Ni-layer material through holes; and (5) overlapping the Ni layer on the Ti layer and carrying out high-temperature laminating and bonding to realize metal alloying.

Description

technical field [0001] The present invention relates to coolers, and more particularly to a method of manufacturing coolers having stacked laminated metal materials. Background technique [0002] In a semiconductor module such as a power semiconductor module, a semiconductor element is mounted on an insulating substrate. And, in order to reduce the temperature of the semiconductor element that rises with the operation of the semiconductor element, the insulating substrate is arranged on the cooling surface of the cooler (including a heat sink, heat sink, heat sink, etc.) and is in contact with the cooling surface. combine. [0003] The insulating substrate has a ceramic layer as an electrical insulating layer, a wiring layer (circuit layer), and the like. The wiring layer is formed of copper, aluminum, or the like. [0004] Coolers made of copper or aluminum (including their alloys) are used as coolers, but the solder jointability of coolers made of aluminum or copper is ...

AI Technical Summary

Problems solved by technology

[0005] However, in the case where the nickel plating layer is formed on the cooling surface of the cooler, the contamination of the nickel plating layer due to insufficient cleaning and drying, etc., may cause poor solder moisture.

In particular, in the case of forming a nickel-plated layer on the entire surface of the cooler, since the shape of the cooler is generally complicated, there is a difficulty that such a solder is prone to poor moisture absorption.

[0006] Although there is a structure in which a Ti layer is added in the middle, due to the plate-like form, there is still a large warpage when heated, resulting in poor brazing

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