Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat dissipation structure and preparation method of stacked chip microfluidic channel

A heat dissipation structure and micro-channel technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as difficulty in dissipating heat from chips, improve yield rate, and facilitate installation and disassembly , The effect of reducing the probability of chip damage

Active Publication Date: 2018-11-23
NAT CENT FOR ADVANCED PACKAGING CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a stacked chip micro-channel heat dissipation structure, and a preparation method for the stacked chip micro-channel heat dissipation structure, which solves the problem that the internal heat of the stacked chip structure is difficult to dissipate. problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation structure and preparation method of stacked chip microfluidic channel
  • Heat dissipation structure and preparation method of stacked chip microfluidic channel
  • Heat dissipation structure and preparation method of stacked chip microfluidic channel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] The stacked chip microfluidic cooling structure provided in this embodiment, such as Figure 4 As shown, it includes a chip substrate 1 and a stacked chip 2 assembled on the chip substrate 1; the stacked chip 2 is packaged by an inner packaging material 3 to form an inner package 30;

[0079] The chip substrate 1 on both sides of the inner package 30 is provided with a coolant inlet 101 and a coolant outlet 102 penetrating the chip substrate 1; a side heat dissipation assembly 4 is provided on the side of the inner package 30, and an upper heat dissipation assembly 5 is provided on the top ; The side heat dissipation assembly 4 and the upper heat dissipation assembly 5 are provided with micro-channels 6 for cooling liquid to flow; The outlet 102 is communicated; the upper cooling assembly 5 is connected to the side cooling assembly 4 and the upper cooling assembly 5 is connected to the micro flow channel in the side cooling assembly 4; Thermally conductive material7. ...

Embodiment 2

[0106] The stacked chip microfluidic cooling structure provided in this embodiment, such as Figure 11 As shown, a chip substrate 1 is included, and a plurality of stacked chip subunits 2' are stacked and assembled on the chip substrate 1,

[0107] Each stacked chip sub-unit 2' is encapsulated by the inner packaging material 3 to form a plurality of inner package sub-units 30'; a heat dissipation adapter plate is provided between the inner package sub-units 30' formed by each stacked chip sub-unit 2' 10. The heat dissipation adapter plate 10 extends out of the inner packaging sub-body 30' to both sides;

[0108] The side of each inner package sub-body 30' is provided with a side heat dissipation assembly 4, and the top of the uppermost inner package sub-body 30' is provided with an upper heat dissipation assembly 5; The micro-channel 6 of the heat dissipation adapter plate 10 is provided with a micro-channel through hole 1001 corresponding to the position of the micro-channel...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a superficial chip microstructure heat dissipation structure, including chip substrates, stack chips assembled on the chip substrate.There are side heat dissipation components, with upper heat dissipation components on the top; side heat dissipation components and upper heat dissipation components are provided with micro -flow channels for cooling liquid flows;The micro -flow channel is connected; the chip substrate on both sides of the inner packaging body is provided with the cooling fluid import and the exit of the coolant substrate penetrating the chip substrate;Import and coolant export connection.The present invention improves the heat dissipation capacity of overlapping chips.

Description

technical field [0001] The invention relates to a package structure, in particular to a package structure of laminated chips. Background technique [0002] In the three-dimensional stacked chip structure, the heat of the inner chip is difficult to dissipate, resulting in chip failure due to the high junction temperature of the inner chip in the stacked structure, which limits the improvement of the integration and performance of the entire device. [0003] For the high power density of stacked chips, the heat dissipation capacity of forced air cooling can no longer be satisfied; and for cooling methods such as liquid and phase change, such as heat pipes or microchannels, there are problems such as larger volume or complicated assembly, which makes these cooling methods It is difficult for this measure to be widely used like a chassis fan; on the other hand, since the micro-channel and heat pipe are surface-attached to the surface of the chip package for heat dissipation, the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473H01L21/48
CPCH01L21/48H01L23/473H01L2924/15311H01L2224/16145H01L2224/16225
Inventor 邱德龙曹立强王启东侯峰泽林来存
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD