Cutting process and device for LED white light chips

Abstract

The invention discloses a cutting technology and device for LED white-light chips. The cutting technology comprises the following steps of obtaining position information of the chips, namely obtaining actual position information of the chips in a whole adhesive film; determining a cutting track, namely obtaining positions of appointed corresponding points on two adjacent rows or columns of chips according to the actual positions of the chips, calculating a mean center point of the same row or column of chips according to the positions of the appointed corresponding points in the same row or column and taking a mean value of the mean center points of two adjacent rows or columns of chips as the cutting track of the two adjacent rows or columns of chips; and carrying out cutting, namely cutting the whole adhesive film according to the obtained cutting track. The cutting technology and device have the beneficial effects that the consistency of colors and light spots is ensured; an unaccepted product or waste product of which the widths of silica gel around the chips are excessively inconsistent is avoided; the quality of the cut product is ensured; artificial monitoring and adjustment are not needed; high efficiency of automatic cutting by using a machine is brought into a full play; the cutting technology and device are simple and reliable; and the cost is reduced.

Description

technical field [0001] The invention relates to a chip cutting process, in particular to a cutting process and device for LED white light chips. Background technique [0002] CSP is the abbreviation of Chip Scale Package. The literal translation is chip-scale packaging, which refers to the direct application of phosphor powder on the surface and surrounding of the chip to make a white light chip. The production process of white light chips is roughly as follows: First, the LED blue light chips are arranged on the high-temperature tape at equal intervals. The usual array of chips ranges from several hundred to several thousand, and then a certain thickness of phosphor powder is applied. Silica gel, after curing, becomes a film of uniform thickness. One side of the LED blue light chip is in contact with the substrate, and the other five sides are covered with silica gel and phosphor; The white light chip is surrounded by silica gel of the same width. [0003] The existing LE...

AI Technical Summary

Problems solved by technology

The row-column spacing of chips is usually only about 0.5mm. If cutting is still carried out according to the spacing set at the beginning, the cutting track will not be on the center line between the chips, and the accumulated error after cutting may even cut to the chip. The width of the silica gel around the cut white chip is not the same, which not only affects the color temperature and light spot, but also affects the positioning during die bonding

[0004] The existing solution is through manual monitoring. When employees find that the cutting deviates from the center line, they stop and adjust, which greatly reduces efficiency and increases labor costs. Moreover, adjustments are often started only when problems arise, which cannot be fundamentally avoided.

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