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Integrated package including microelectromechanical system acoustic sensor and environmental sensor and method of manufacturing the same

A sensor and packaging technology, applied in the field of sound-sensitive and environmental sensors, can solve problems such as defects

Active Publication Date: 2018-07-06
INVENSENSE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another challenge occurs during release etching, a process used during the manufacture of acoustic sensors that, in most if not all cases, occurs when the polymer undergoes adverse effects causing it to create defects
Such disadvantages prevent the integration of acoustic sensors and environmental sensors on the same IC substrate and / or packaging substrate

Method used

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  • Integrated package including microelectromechanical system acoustic sensor and environmental sensor and method of manufacturing the same
  • Integrated package including microelectromechanical system acoustic sensor and environmental sensor and method of manufacturing the same
  • Integrated package including microelectromechanical system acoustic sensor and environmental sensor and method of manufacturing the same

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Embodiment Construction

[0020] In the described embodiments, an integrated circuit (IC) substrate may refer to a silicon substrate with electronic circuitry, typically CMOS circuitry. Additionally, a CMOS IC substrate may include an ASIC. A cavity may refer to a recess in a substrate or a cover (or lid). An enclosure may refer to a completely enclosed volume generally surrounding the MEMS structure and generally formed by the IC substrate, structural layers, MEMS substrate, and standoff seal ring. A port may be an opening through a substrate to expose the MEMS structure to the surrounding environment. It is to be understood that in various embodiments of the subject disclosure, a housing will include sound sensitive ports.

[0021] In the described embodiments, a chip includes at least one substrate, typically formed of a semiconductor material. A single chip can be formed from multiple substrates, wherein the substrates are mechanically bonded to maintain functionality. The plurality of chips in...

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Abstract

An integrated package including at least one environmental sensor and at least one MEMS acoustic sensor is disclosed herein. The package includes a shared port for exposing the two sensors to the environment, wherein the environment sensor measures a characteristic of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to airflow and the acoustic sensor to sound waves. One embodiment of the acoustic sensor is a microphone, and one embodiment of the environmental sensor is a humidity sensor.

Description

[0001] Cross-reference to related applications [0002] This application claims priority to U.S. Patent Application Serial No. 14 / 273,845, filed May 9, 2014, entitled "Integrated Package Containing Micro-Electro-Mechanical System Acoustic Sensors and Environmental Sensors and Method of Making the Same," This patent application is hereby incorporated by reference in its entirety. technical field [0003] Embodiments of the subject disclosure generally relate to acoustic and environmental sensors, and more particularly to integrated packages of such sensors. Background technique [0004] The integration of component devices of consumer electronic products facilitates the reduction of form factor. Integration often reduces size by making multiple devices part of an integrated system. The integrated system itself can also be progressively reduced in size over time. Integrating multiple devices into a system is complex, and even more complex where each device is a different ty...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00B81B7/02G01L23/08
CPCB81B2201/0292H04R1/04H01L2224/73265H01L2924/16152H04R2201/003H01L2224/48091H01L2224/48465B81B2207/012B81C1/0023B81B2201/0264B81B2201/0257B81B2201/0278B81B2201/0214B81B7/02H01L2924/00014H01L2924/00H04R19/04B81B2207/07B81C2203/0792H04R29/004
Inventor J·M-L·特赛B·恰达塞尔M·利姆A·S·亨金
Owner INVENSENSE
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