Semiconductor component image test device and its test equipment

Abstract

The invention relates to a semiconductor element image test device and test equipment thereof. The semiconductor element image test device comprises a test circuit module and a movable light source module. The test circuit module is arranged on a main frame connected to a test head, and comprises at least one circuit board, one interface board, and a probe test base fixedly arranged on the interface board. The movable light source module is arranged on an elevating device and comprises a base, a light source supply device, and a lens set carrier plate, on which a plurality of lens are loaded. The elevating device can selectively drive the movable light source module to make the movable light source module contact with or does not contact with the test circuit module, and thus at least half of semiconductor elements in a test carrier plate contacts with or does not contact with the probe test base. Through the setting of modules, the light source supply device and a plurality of optical lens can be conveniently installed, maintained, and picked / placed. At the same time, the test signals can be directly delivered to the image test circuit and test probe, and the signal transmission stability is enhanced.

Description

technical field [0001] The invention relates to a semiconductor element image test device and its test equipment, especially a test device and its test equipment suitable for testing the image characteristics of a semiconductor element. Background technique [0002] With regard to the existing semiconductor device image testing device, the current configuration structure on the market is to set the test light source in a test head located under the machine table, and set a load board, a load board, and a test head on the test head in sequence The test board (DUT board) and a carrier plate for placing semiconductor components, and in the process of image testing, the semiconductor components and the test board are pressed down through a pin tester on a sorter, and the test signal is flattened The cables are fed into the test head for analysis of the vision test results. [0003] However, under this test framework, more than two sets of circuit boards, the load board and the ...

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Problems solved by technology

[0003] However, under this test framework, more than two sets of circuit boards, the load board and the DUT board, must be used for power supply requirements and signal transmission. Among them, the bandwidth is relatively narrow and cannot reach high-speed transmission frequency, so it cannot meet the test specifications of high-performance semiconductor components

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