Sealing method of heat-conducting component

A technology for thermally conductive components and components, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve problems such as circuit short circuit and leakage

Active Publication Date: 2017-03-08
NUBIA TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as heat dissipation materials used in electronic products, metal phase change materials wi...

Method used

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  • Sealing method of heat-conducting component
  • Sealing method of heat-conducting component
  • Sealing method of heat-conducting component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] An embodiment of the present invention proposes a mobile terminal, a schematic diagram of a hardware structure of the mobile terminal is shown in figure 1 shown.

[0083] In this example, if image 3 As shown, the mobile terminal includes:

[0084] PCB 31;

[0085] A chip 32 is fixed on the PCB 31, and the chip 32 can generate heat during operation;

[0086] The shielding cover 33 is fixed to the PCB 31, that is, it is arranged on the PCB 31 and surrounds the chip 32. Part of the shielding cover 33 forms a groove above the chip 32, and the groove The bottom is in contact with the upper surface of the chip 32;

[0087] The first heat conduction component 34 is arranged in the groove; the first heat conduction component 34 is a metal phase change material;

[0088] The heat-conducting middle frame 35 is connected with the shield cover 33 to seal the groove into a sealed space; wherein,

[0089] After the middle frame 35 is connected to the shielding case 33, the fir...

Embodiment 2

[0120] An embodiment of the present invention proposes a mobile terminal, a schematic diagram of a hardware structure of the mobile terminal is shown in figure 1 shown.

[0121] In this example, if image 3 As shown, the mobile terminal includes:

[0122] PCB 31;

[0123] A chip 32 is fixed on the PCB 31, and the chip 32 can generate heat during operation;

[0124] The shielding cover 33 is fixed to the PCB 31, that is, it is arranged on the PCB 31 and surrounds the chip 32. Part of the shielding cover 33 forms a groove above the chip 32, and the groove The bottom is in contact with the upper surface of the chip 32;

[0125] The first heat conduction component 34 is arranged in the groove; the first heat conduction component 34 is a metal phase change material;

[0126] The heat-conducting middle frame 35 is connected with the shield cover 33 to seal the groove into a sealed space; wherein,

[0127] After the middle frame 35 is connected to the shielding case 33, the fir...

Embodiment 3

[0162] Based on the mobile terminal provided in Embodiment 1 of the present invention, this embodiment provides a method for sealing heat-conducting components, such as Figure 4 As shown, the method includes the following steps:

[0163] Step 401: Fix the shielding cover provided with the groove on the PCB on which the chip is fixed, and surround the chip;

[0164] Here, the chip can generate heat during operation.

[0165] Part of the shielding cover forms the groove above the chip, and the bottom of the groove is in contact with the upper surface of the chip.

[0166] In one embodiment, the method may also include:

[0167] The chip is fixed on the PCB by patching.

[0168] Wherein, in actual application, the most commonly used method of mounting is: soldering the chip on the PCB by using solder strips (wires) or the like.

[0169] Correspondingly, the shielding case can be fixed on the PCB by means of patches.

[0170] In one embodiment, the method may also include: ...

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PUM

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Abstract

The invention discloses a sealing method of a heat-conducting component. The sealing method comprises the steps of fixing a shielding case provided with a groove on a PCB (Printed Circuit Board) fixedly provided with a chip, surrounding the chip, arranging a first heat-conducting component in the groove, and connecting a middle frame with the shielding case to seal the groove into a sealed space, wherein the chip can generate heat during working; the groove is formed in the partial shielding case above the chip; the bottom of the groove is contacted with the upper surface of the chip; and the first heat-conducting component is made of a metal phase change material, and located in the sealed space.

Description

technical field [0001] The invention relates to terminal technology, in particular to a sealing method for a heat-conducting component. Background technique [0002] With the development of smart electronic products, the number of cores of the central processing unit (CPU, Central Processing Unit) is increasing; users' pursuit of large-scale three-dimensional (3D) games and high-definition videos has led to the development of mobile phones, tablet computers and other products. The heat is getting bigger and bigger, which seriously affects the user experience. [0003] In order to solve the heat dissipation problem of these intelligent electronic products, it is proposed to use a metal phase change material with high thermal conductivity as the heat dissipation material used in the electronic products. However, as heat dissipation materials used in electronic products, metal phase-change materials undergo phase changes during use, which may cause leakage problems and cause s...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/433
CPCH01L23/4275H01L23/4334
Inventor 龙静罗孝平
Owner NUBIA TECHNOLOGY CO LTD
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