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High-reliability oxide layer polishing device for copper-clad plate pretreatment

A pretreatment and oxide layer technology, which is applied in grinding/polishing equipment, metal processing equipment, and machine tools suitable for grinding workpiece planes, etc., can solve the problems of inability to grind copper clad laminates and high labor intensity of operators, and achieve structural The effect of simplicity, good plasticity and long working life

Inactive Publication Date: 2017-03-15
GUANGDONG POLYTECHNIC NORMAL UNIV
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Problems solved by technology

[0006] In order to overcome the shortcomings in the prior art that the surface of the copper-clad laminate cannot be polished and the labor intensity of the operators is high, the technical problem to be solved by the present invention is to provide an oxidizer for pretreatment of the copper-clad laminate that can reduce the labor intensity of the operators. Layer high reliability grinding equipment

Method used

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  • High-reliability oxide layer polishing device for copper-clad plate pretreatment

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Embodiment 1

[0028] A high-reliability polishing equipment for the pretreatment of copper clad laminates, such as Figure 1-3 As shown, it includes a processing box 1, a first rotating shaft 2, a first bearing seat 3, a second bevel gear 4, a second rotating shaft 5, a second bearing seat 6, a second pulley 7, a flat belt 8, a slider 9, The third bearing seat 11, the first pulley 12, the third rotating shaft 13, the third bevel gear 14, the rotating electric machine 15, the fourth bevel gear 16, the fourth rotating shaft 17, the grinding block 18, the processing table 19, the slide rail 20, the tooth Strip 21, first bevel gear 22 and first gear 23; the inner right wall of the processing box 1 is connected with a third bearing seat 11 and a second bearing seat 6 by bolt connection, and the third bearing seat 11 is located in the second bearing seat 6 Above, the inner bearing of the third bearing housing 11 is connected to the third rotating shaft 13 by interference fit, and the third bevel g...

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Abstract

The invention relates to a polishing device, in particular to a high-reliability oxide layer polishing device for copper-clad plate pretreatment. The high-reliability oxide layer polishing device for the copper-clad plate pretreatment aims to achieve the technical effects of being capable of lowering the labor intensity of workers. The high-reliability oxide layer polishing device for the copper-clad plate pretreatment comprises a treatment box, a first rotating shaft, a first bearing seat, a second bevel gear, a second rotating shaft, a second bearing seat, a second belt pulley, a flat belt, a sliding block, a third bearing seat and the like. The third bearing seat is located above the second bearing seat. An inner bearing of the third bearing seat is connected with a third rotating shaft in an interference fit manner. The high-reliability oxide layer polishing device for the copper-clad plate pretreatment achieves the effects of being capable of polishing copper-clad plates, simple in structure and easy to operate. Besides, when a rotating motor operates, a polishing block can be made to conduct polishing work at the same time.

Description

Technical field [0001] The invention relates to a polishing equipment, in particular to a high-reliability polishing equipment for an oxide layer used for the pretreatment of a copper clad laminate. Background technique [0002] Copper clad laminate, also known as base material, is a plate-like material made by impregnating a reinforcing material with resin, one or both sides with copper foil, and then hot pressing. Before the copper clad laminate is used, the surface of the copper clad laminate needs to be oxidized The layer is polished. [0003] Chinese patent CN203650204U, in view of the existing problem of oxide layer polishing, discloses a metal belt surface oxide layer polishing device, which realizes continuous and double-sided polishing of the metal oxide layer by means of a frame and a wheel grinder. However, because the design is not comprehensive enough, the device cannot polish the surface of the copper clad laminate, which will cause the problem of high labor intensit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/02B24B27/033B24B47/04B24B47/12
CPCB24B7/02B24B27/0092B24B27/033B24B47/04B24B47/12
Inventor 姚屏
Owner GUANGDONG POLYTECHNIC NORMAL UNIV
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