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10G PON (passive optical network) BOSA (bi-direction optical sub assembly) attached module

A technology of patch and driving circuit, applied in the field of optical communication, can solve problems such as unfavorable wiring and layout, increase the cost of optical modules, and unfavorable heat dissipation of optical modules, so as to facilitate disassembly, maintenance, upgrade and replacement, facilitate miniaturization, and promote promotion. Effect

Inactive Publication Date: 2017-03-15
BOWEI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] By providing a 10G PON BOSA sticker, the present invention solves the problem that the 10G PON optical module adopts SFP+ or XFP package in the prior art, which is not conducive to wiring and layout, and the metal shell increases the cost of the optical module and is not conducive to the heat dissipation of the optical module. Problem, realized the miniaturization design of PON BOSA paste, good heat dissipation effect, low cost, and promoted the promotion of 10G PON technology

Method used

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  • 10G PON (passive optical network) BOSA (bi-direction optical sub assembly) attached module
  • 10G PON (passive optical network) BOSA (bi-direction optical sub assembly) attached module

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Embodiment 1

[0038] see Figure 2-Figure 4 , in the 10G PON BOSA paste provided in this embodiment, the substrate 3 is a PCB board, and a BOSA drive circuit is integrated in the PCB board; the BOSA device 2 is attached to the PCB board, and the BOSA device 2 is electrically connected to the BOSA drive circuit; the PCB board There is a BOSA sticker interface 1 on the top, and the BOSA sticker interface 1 is electrically connected with the BOSA driving circuit. The BOSA sticker interface 1 is connected to the external equipment main board 5, and the external equipment main board 5 adopts an OLT. The BOSA paste interface 1 is provided with a pin row 4, which is arranged in two rows, and the pin row 4 is electrically connected with the BOSA drive circuit; the external device motherboard 5 is provided with a jack 6 that matches the pin row 4, and the pin row 4 is electrically connected to the BOSA driving circuit; 4 is inserted into the socket 6, and the BOSA device 2 is bonded on the PCB.

Embodiment 2

[0040] see Figure 5-Figure 7 , in the 10G PON BOSA paste provided in this embodiment, the substrate 3 is a PCB board, and a BOSA drive circuit is integrated in the PCB board; the BOSA device 2 is attached to the PCB board, and the BOSA device 2 is electrically connected to the BOSA drive circuit; the PCB board There is a BOSA sticker interface 1 on the top, and the BOSA sticker interface 1 is electrically connected to the BOSA drive circuit. The BOSA sticker interface 1 is connected to the main board 5 of the external device, and the main board 5 of the external device adopts ONT. SMD pins 7 are arranged on the BOSA paste interface 1, and the SMD pins 7 are arranged in two rows, and the SMD pins 7 are electrically connected to the BOSA driving circuit. The main board 5 of the external device is provided with pads 8 matched with the patch pins 7, the patch pins 7 are welded on the pads 8, and the BOSA device 2 is bonded on the PCB.

Embodiment 3

[0042] see Figure 8-Figure 11, in the 10G PON BOSA paste provided in this embodiment, the substrate 3 is a PCB board, and a BOSA drive circuit is integrated in the PCB board; the BOSA device 2 is attached to the PCB board, and the BOSA device 2 is electrically connected to the BOSA drive circuit; the PCB board There is a BOSA sticker interface 1 on the top, and the BOSA sticker interface 1 is electrically connected with the BOSA driving circuit. The BOSA sticker interface 1 is connected to the external equipment main board 5, and the external equipment main board 5 adopts an OLT. The BOSA paste interface 1 is provided with a pressing pin 9, and the pressing pin 9 is electrically connected with the BOSA driving circuit; the external device main board 5 is provided with a groove 10 matching the pressing pin 9, and the pressing pin 9 is pressed into the groove 10, and the BOSA device 2 is attached to the PCB. The 10G PON BOSA paste is fixed on the main board of the external dev...

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Abstract

The invention belongs to the optical communication technique technical field and relates to a 10G PON (passive optical network) BOSA (bi-direction optical sub assembly) attached module. The 10G PON (passive optical network) BOSA (bi-direction optical sub assembly) attached module comprises a substrate and a BOSA device; a BOSA driving circuit is integrated in the substrate; the BOSA device is attached to the substrate; the BOSA device is electrically connected with the BOSA driving circuit; the substrate is provided with a BOSA attached module interface; the BOSA attached module interface is electrically connected with the BOSA driving circuit; and the BOSA attached module interface is used for connecting an external device motherboard. Since the BOSA device is directly connected with the external device motherboard, a metal shell as well as an additional metal shell fixing seat and connecting seat are not required, and therefore, the miniaturized design of the PON BOSA attached module is realized, a heat dissipation effect is good, manufacturing cost is low, disassembly, repair, upgrade and replacement are facilitated, and the popularization of 10G PON technologies is promoted.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a 10G PON BOSA sticker. Background technique [0002] Currently used 10G PON (Passive Optical Network, Passive Optical Network) optical modules, including 10G / 1G EPON (Ethernet Passive Optical Network, Ethernet Passive Optical Network), 10G / 10G EPON, XG-PON1 and XG-PON2, etc. , most of them are packaged in SFP+ or XFP, and use a metal casing, which requires an optical module casing fixing seat and an optical module interface seat, which is high in cost, is not conducive to mass use, and hinders the promotion of 10G PON technology. Due to the metal casing of the existing 10G PON optical module circuit, it will not be conducive to air circulation in a high-temperature environment, and the heat dissipation effect will not be achieved, and the requirement for a high working environment temperature will be limited. Existing 10G PON optical modules are packaged in SFP+ o...

Claims

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Application Information

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IPC IPC(8): G02B6/42
CPCG02B6/4201
Inventor 何茂平李汝虎蔡舒宏
Owner BOWEI TECH
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