Bonding pad structure, welding ring structure and packaging method for MEMS (Micro-Electro-Mechanical Systems) device

Abstract

The invention discloses a bonding pad structure, a welding ring structure and a packaging method for an MEMS (Micro-Electro-Mechanical Systems) device. Composition materials of the bonding pad structure comprise first metal and second metal. In at least one bisected section of the bonding pad structure, both the first metal and the second metal appear at least once. The bisected section is obtained by sectioning the bonding pad structure along a perpendicular bisection plane. The perpendicular bisection plane is perpendicular to a lookdown plane of the bonding pad structure. The bonding pad structure can be bisected into two parts with equal sizes by the perpendicular bisection plane. When bonding is carried out through the bonding pad structure, alloy is directly formed between the first metal and the second metal, the first metal and the second metal are prevented from overflowing from the periphery of the bonding pad structure in the bonding process, namely through adoption of the bonding pad structure, an extrusion extension phenomenon can be prevented, a short circuit is prevented from occurring between the bonding pad structure and a peripheral conductive structure, and the reliability of a packaging structure employing the bonding pad structure is improved.

Description

Technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a bonding pad structure, a welding ring structure and a packaging method for MEMS devices. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS), also known as micro-electro-mechanical systems, micro-systems or micro-machines, are developed on the basis of microelectronics technology and semiconductor manufacturing technology, integrating thin film, photolithography, and etching , Bonding, silicon micromachining, non-silicon micromachining and precision machining technology, high-tech electronic mechanical devices produced. There are many types of MEMS devices, including MEMS sensors and MEMS actuators. Among them, MEMS sensors are widely used in protection systems such as automobiles, inertial guidance systems, household appliances and various equipment, and many other industrial, scientific and engineering systems. The MEMS sensor may specifically be an a...

AI Technical Summary

Problems solved by technology

when using image 3 In this whole-surface pad structure, the material with better ductility is prone to extrusion and extension during the bonding process, that is, during the bonding process, the metal material with better ductility will move toward the periphery of the pad structure. massive overflow

Once the metal material overflows to the periphery of the pad, it will easily lead to problems such as short circuit of the adjacent conductive structure, which will reduce the reliability of the package structure

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