High-frequency inductor with embedded radiator

A heat sink and inductor technology, which is applied in the field of inductors, can solve the problems of low heat dissipation efficiency, wire consumption, and high cost, and achieve the effects of increased heat conduction area, high heat conduction efficiency, and low inductor temperature rise

Active Publication Date: 2017-04-19
SHENZHEN YINLI ELECTRIC APPLIANCES MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] First, although air ducts are arranged in the inductance winding, although the heat dissipation problem can be alleviated to a certain extent, the heat dissipation efficiency is low, and the size of the inductance winding becomes larger, consuming a lot of wires, especially when the winding wires are copper wires, the cost is high
[0013] Second, the heat dissipation uniformity of the radiator with a shell is poor, and it cannot effectively realize the heat dissipation problem between the phases of the inductor or the transformer, so that the phases are prone to local overheating

Method used

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  • High-frequency inductor with embedded radiator
  • High-frequency inductor with embedded radiator
  • High-frequency inductor with embedded radiator

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Embodiment Construction

[0020] Such as Figures 1 to 3 As shown, a high-frequency inductor embedded in a radiator mainly includes an inductor 1 and a radiator 2. The radiator is made of a metal material with high thermal conductivity. The radiator is composed of a base plate 21 and surrounding plates The cavity 23 jointly surrounded by 22 has an opening 24 in the direction opposite to the bottom plate; the inductor 1 is embedded in the radiator cavity 23 through the opening 24; the radiator 2 also includes a tongue extending from the bottom plate 21 to the opening 24 Plate 25; the tongue plate 25 is inserted between phases of the inductor winding, between the rear outer surface of the inductor winding and the inner surface of the bottom plate, between the side surface of the inductor winding and the corresponding inner surfaces of the two surrounding plates 22 There is a gap between the tongue plate 25 and the inductor winding phase, and each gap is filled with heat-conducting silica gel.

[0021] F...

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Abstract

The invention relates to an inductor, especially relates to a high-frequency inductor with an embedded radiator, and belongs to the technical field of inductor structure design, wherein the inductor is used in a power electronic high-frequency filter system. The invention aims at solving problems that a conventional natural cooling inductor is low in radiation frequency, is large in size, is high in cost, is poor in radiation uniformity, and is liable to cause local overheating between phases. The high-frequency inductor mainly comprises an inductor and a radiator. The radiator is a cavity formed through the enclosing of a bottom plate and surrounding plates. An opening is disposed in a direction opposite to the bottom plate, and the inductor is embedded into the cavity of the radiator through the opening. The radiator also comprises a tongue plate which extends from the bottom plate to a cover plate. The tongue plate is inserted between the phases of an inductor winding, and heat-conducting silica gel is disposed between a gap between the inductor and the cavity. The inductor is used in the structural design of a power electronic high-frequency inductor, can improve the heat-dissipation efficiency, and avoid the local overheating.

Description

technical field [0001] The invention relates to an inductor, in particular to a high-frequency inductor embedded in a radiator, which is used in a power electronic high-frequency filter system and belongs to the technical field of inductor structure design. Background technique [0002] With the development of industrial technology, the development goals of high-frequency inductors are small size, light weight, low cost, and high power density. Thermal balance, especially dry-type self-cooling high-frequency inductors, due to the problem of temperature rise caused by slow heat dissipation, seriously restricts the improvement of the power density of high-frequency inductors. [0003] Liquid cooling and forced air cooling high-frequency inductor technology are relatively mature, and the products are also diverse. However, due to the configuration of special liquid cooling systems and air cooling systems, although the cooling efficiency of these products is higher than that of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/08H01F27/00H01F30/06
CPCH01F27/08H01F27/22H01F30/06
Inventor 焦海波
Owner SHENZHEN YINLI ELECTRIC APPLIANCES MFG
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