Supercharge Your Innovation With Domain-Expert AI Agents!

A uniform cutting device for blister material

A cutting device and a technology of plastic-absorbing materials, which are applied in metal processing and other directions, can solve the problems of cutting large sheets evenly into individual products, and the tools are not advanced, so as to improve the service life, save materials and prolong the service life. Effect

Inactive Publication Date: 2018-06-15
佛山市顺德区陇盛机械有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the production process of blister products, it is necessary to cut some large sheets evenly into individual products, but at present, in some smaller factories, it is difficult to cut large sheets The sheet is evenly cut into individual products, so it is urgent to develop a blister material uniform cutting device suitable for small blister factories that can evenly cut large sheets into individual products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A uniform cutting device for blister material
  • A uniform cutting device for blister material
  • A uniform cutting device for blister material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A device for evenly cutting blister materials, such as Figure 1-5 As shown, it includes a bottom plate 1, a right frame 2, a left frame 3, a first slide rail 4, a second slide rail 5, a first slide block 6, a first wedge block 8, a second slide block 9, a pull wire 10, a Fixed pulley 11, first rubber block 12, placement plate 13, first spring 15, second wedge block 16, hinge 17, top plate 18, third slide rail 19, third slide block 20, electric push rod 21, The third wedge block 22, roller 23, fixed plate 24, second spring 25, second fixed pulley 27, lifting rod 28, mounting plate 29, bearing seat 30, guide plate 31, rotating motor 32, second rubber block 33 , the third rubber block 34, the cutting piece 35 and the rotating shaft 36, the left frame 3 is welded on the left side of the top of the base plate 1, the left side of the top of the base plate 1 is connected with the first slide rail 4 through the connection mode of bolts, and the first slide rail 4 is located on...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a cutting device, in particular to a uniform blister package material cutting device. The invention aims to solve the technical problems so as to provide the uniform blister package material cutting device suitable for a small blister factory and capable of uniformly cutting a large sheet into single products. In order to solve the technical problems, the invention provides the uniform blister package material cutting device, which comprises a base plate, a right support, a left support, a first slide rail, a second slide rail, a first slide block, a first wedge block, second slide blocks, a stay wire, a first fixed pulley, first rubber blocks and the like. The left support is welded to the left side of the top part of the base plate; and the first slide rail is connected to the left side of the top part of the base plate through a bolt connection way, and is located at the right side of the left support. According to the uniform blister package material cutting device provided by the invention, a uniform cutting effect can be achieved by utilizing uniform installation of cutting disks, and meanwhile, the downward movement of the cutting disks is realized through the interaction of the first wedge block, a second wedge block and a third wedge block.

Description

technical field [0001] The invention relates to a cutting device, in particular to a uniform cutting device for plastic-absorbing materials. Background technique [0002] Blister molding is a kind of plastic processing technology. The main principle is to heat and soften the flat plastic hard sheet, then vacuum absorb it on the surface of the mold, and shape it after cooling. It is a technical process applied to various industries. Blister products are widely used, mainly used in electronics, electrical appliances industry, food industry, hardware tools, cosmetics industry, toy industry, daily necessities industry, medicine, health care products, automobiles, stationery, stationery, stationery and other industries. [0003] In the production process of blister products, it is necessary to cut some large sheets evenly into individual products, but at present, in some smaller factories, it is difficult to cut large sheets The sheets are evenly cut into individual products, so...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B26D1/12B26D7/02B26D5/06
CPCB26D1/125B26D5/06B26D7/015B26D7/02
Inventor 张晓军
Owner 佛山市顺德区陇盛机械有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com