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Pre-plated tin molding system and pre-plated tin molding method

A forming method and pre-tinning technology, applied in auxiliary devices, circuit inspection/monitoring/correction, printed circuits, etc., can solve problems such as electrical connection failure, reduce virtual soldering and false soldering, and ensure soldering quality.

Active Publication Date: 2017-05-03
TYCO ELECTRONICS DONGGUAN +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practice, there are often problems with electrical connection failure due to conditions such as virtual and false soldering between electrical contacts and tinned pads

Method used

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  • Pre-plated tin molding system and pre-plated tin molding method
  • Pre-plated tin molding system and pre-plated tin molding method
  • Pre-plated tin molding system and pre-plated tin molding method

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Embodiment Construction

[0035] Specific embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like reference numerals designate like or similar elements throughout. The specific embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but not construed as a limitation of the present invention.

[0036] see figure 1 , which shows a schematic structural view of a pre-tin plating forming system according to a specific embodiment of the present invention. As shown in the figure, the present invention provides a pre-tinning forming system for forming the shape of the pre-tinning 5 on the welding pad of the circuit board 4 . The pre-tinning forming system mainly includes: a hot pressing unit 1, a board holding unit 2 and a moving unit 3; wherein, the board holding unit 2 is used to fixedly hold the circuit board 4; The pre-tinning 5 performs a h...

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PUM

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Abstract

The invention provides a pre-plated tin molding system and a pre-plated tin molding method. The pre-plated tin molding system is used for molding the shape of pre-plated tin (5) on a welding pad of a circuit board (4). The system comprises a plate fixed holding unit (2) used for fixedly holding the circuit board, a hot-pressing unit (1) used for hot-pressing the pre-plated tin on the circuit board to mold the shape of the pre-plated tin, and a moving unit (3) used for moving the hot-pressing unit relative to the plate fixed holding unit, wherein the hot-pressing unit is provided with a hot-pressing device (10) used for molding the shape the pre-plated tin on the circuit board. According to the pre-plated tin molding system and the pre-plated tin molding method provided by the invention, the position of an electric contact on the welding pad of the circuit board in welding operation is controlled accurately by molding the pre-plated tin on the welding pad of the circuit board, so that the quality of welding is ensured, and the risk of pseudo soldering and false soldering is reduced.

Description

technical field [0001] The invention relates to the technical field of electrical connectors, in particular to a system and method for forming pre-tinned soldering pads of circuit boards. Background technique [0002] In the field of electrical connector technology, a circuit board with tinned pads is the basic device, wherein the tinned pads are usually formed on the surface of the circuit board by SMT technology, and the electrical contacts are welded by, for example, cold soldering soldered to the tinned pads of the circuit board to form an electrical connection to the electrical connector. However, in practice, there is often a problem of electrical connection failure due to conditions such as virtual soldering and false soldering between the electrical contacts and the tin-plated pads. Contents of the invention [0003] The present invention aims to overcome or alleviate at least one or more technical problems existing in the above-mentioned existing technologies. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K2203/0435H05K2201/09381H05K2203/0195H05K2203/0278H05K2203/0392H05K1/117H05K3/3405H05K2201/09745H05K2201/10287H05K2203/0165H05K2203/1105B23K1/0016B23K1/20B23K3/08H05K3/101H05K3/403H05K2203/16
Inventor 申宏洲张丹丹曾庆龙鲁异乔治·杜宾尼克兹
Owner TYCO ELECTRONICS DONGGUAN