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Cavity temperature control disc with air exhaust holes

A technology of air extraction holes and cavities, which is applied in the field of temperature control panels with side air extraction holes, can solve the problems of low heat conduction efficiency and achieve the effect of ensuring stability

Inactive Publication Date: 2017-05-10
PIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, semiconductor thin film deposition reactions are mostly carried out under vacuum conditions. In vacuum conditions, heat conduction mainly depends on radiation. The heat conduction efficiency is low, and heat will accumulate on the wafer surface.

Method used

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  • Cavity temperature control disc with air exhaust holes
  • Cavity temperature control disc with air exhaust holes
  • Cavity temperature control disc with air exhaust holes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0025] see figure 1 , a side suction hole type cavity temperature control plate, mainly composed of five parts, the temperature control plate upper plate body 1; ceramic column 2; steady flow plate 3; lower plate body 4; After the corresponding features of each part are processed, welding is performed. Complete the processing of the entire temperature control plate. Specifically: including the upper plate body 1, the lower plate body 4, and the setting of the stabilizing plate 3 between the upper plate body 1 and the lower plate body 4, the hole temperature plate is divided into upper and lower chambers, wherein the upper chamber is a thermal chamber. The medium circulation cavity, the lower chamber is a steady flow chamber, and a plurality of heat conduction gas holes 8 are arranged on the upper plate body 1. The air extraction hole 9 leads into the steady flow chamber, and the heat conduction gas inlet hole 20 provided on the lower plate body 1 leads into the steady flow c...

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Abstract

The invention relates to a cavity temperature control disc with air exhaust holes and belongs to the technical field of deposition application and manufacture of semiconductor films. The cavity temperature control disc comprises an upper disc body, a lower disc body and a steady flow plate positioned between the upper disc body and the lower disc body, wherein the steady flow plate divides the temperature control disc into an upper cavity and a lower cavity; the upper cavity is a heat medium circulating cavity; the lower cavity is a steady flow cavity; a plurality of heat conduction air holes are formed in the upper disc body; each heat conduction air hole communicates with the interior of the steady flow cavity through a pipe fitting; the air exhaust holes are uniformly formed in the upper disc body and communicate with the interior of the steady flow cavity; and a heat conduction air inlet hole is formed in the lower disc body and communicates with the interior of the steady flow cavity. As the air exhaust holes are formed, residual air is exhausted by the air exhaust holes, and accordingly, not only is the temperature of wafers effectively controlled, but also the stability of the wafers is guaranteed.

Description

technical field [0001] The invention relates to a side suction hole type cavity temperature control plate, which belongs to the technical field of semiconductor thin film deposition application and manufacture. Background technique [0002] Semiconductor equipment often needs to heat the wafer and the chamber or maintain the temperature required for the deposition reaction during the deposition reaction, so the heating plate must have a heating structure to meet the purpose of preheating the wafer. Most of the semiconductor thin film deposition equipment will have plasma to participate in the deposition reaction during the deposition process. Due to the release of plasma energy and the energy release of the reaction between chemical gases, the temperature of the heating plate and wafer will increase with the increase of radio frequency and process time. The temperature will continue to rise; if the process is carried out at the same temperature, it is necessary to wait for t...

Claims

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Application Information

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IPC IPC(8): C23C16/52
CPCC23C16/52
Inventor 吕光泉吴凤丽郑英杰张建
Owner PIOTECH CO LTD
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